Optimization design skills of circuit board heat dissipation :1. Heat dissipation by PCB board itself,2. High heating device with radiator, heat conduction plate,3. For the use of free convection air cooling equipment, the integrated circuit is arranged i
SMT patch processing main characteristics: 1, high density: 2, small aperture: 3, low coefficient of thermal expansion: 4, high temperature resistance performance:
Manual welding methods for SMT patch processing of leadless chip components: one by one welding spot, two, using special tools horseshoe iron head welding, three, using flat chip iron head quick welding
The reasons for the need for post-welding processing are as follows: 1, the components are not resistant to high temperature, 2, the components are too high, 3, there are a small number of plug-ins in the side of the wave crest, 4, the components plug-in
SMT SMT technology: The main content of surface assembly technology can be divided into four parts: assembly material selection, assembly process design, assembly technology and assembly equipment application.
Application scope: SMT, LED, BGA, CSP flip chip testing, semiconductor, packaging components, lithium industry, electronic components, automotive parts, photovoltaic industry, aluminum die casting, molded plastics, ceramic products and other special indus
Common PCB welding pad over wave soldering defects have the following points: (1) board surface dirty. (2) PCB deformation. (3) drop (drop) the piece. (4) Other recessive defects.
In the dispensing process, the technical parameters of the patch glue and the dispensing machine can be changed as follows: (1) the rheology of the patch glue. (2) The initial adhesive strength of the patch adhesive. (3) glue point contour. (4) glue point
A perfect PCB board not only needs to do the component selection and setting is reasonable, but also needs to have good signal conduction performance.
In the SMT process of the PCB manufacturer, the solder paste printing, the operation of the SMT machine, and the welding of the reflow welding furnace should be listed as the key processes.
Take a look at BAG difficult chip repair process, requirements for equipment, personnel: 1, rework requirements for process equipment, 2, components of the temperature requirements, 3, components compatibility, 4, temperature difference Settings, 5, tempe
Some measures can be taken to clean the tail of PCBA production and processing to improve work efficiency: 1. About 40pcs of PCB board shall be checked and signed by the quality engineer before the product comes off the line. 2. The operator or inform the
