Five methods to eliminate SMT machining defects - welding pores
There are five methods to solve the welding porosity of the patch: 1, baking, 2, tin paste, 3, humidity, 4, furnace temperature curve, 5, flux
There are five methods to solve the welding porosity of the patch: 1, baking, 2, tin paste, 3, humidity, 4, furnace temperature curve, 5, flux
SMT SMT processing discarding solutions: 1. Clean and replace the nozzle, 2. Clean and wipe the surface of the identification system, keep it clean, free of debris, 3. Adjust the suction position, 4. Sharply adjust the air pressure to the required pressur
Solder paste printing principle: solder paste contact solder paste through the steel plate hole, printed on the substrate tin pad (PCB plate solder plate).
Follow reasonable testing methods to avoid various defects and hidden dangers: I. Incoming SMT material testing; II. SMT processing testing
Four suggestions for PCB design: 1, about positioning hole, 2, about MARK point, 3, about 5mm edge, 4, do not directly on the pad over the hole,
With the popularity of SMT lead-free process technology, the demand for PCB substrate is getting higher and higher. The performance of PCB can be improved from the design of PCB.
Why do you want to talk about the schematic principle in detail, because the schematic diagram contains a lot of information to draw PCB, such as the access point of the element pin, the current size of the node network, etc., see clearly the schematic di
Any non-standard operation in any link will seriously affect the quality of PCBA patch. The quality of PCBA patch can be controlled through the key links of steel mesh making, solder paste control, furnace temperature curve setting and AOI detection.
In the process of PCB processing, in addition to batch welding by reflow welding and wave soldering, manual welding is also needed to produce complete products.
The FPC board is soft and not vacuum packed when leaving the factory. It is easy to absorb moisture in the air during transportation and storage. It needs to be pre-baked before SMT line casting to slowly force out the moisture.
If the temperature of the board reaches the upper Tg value, the board will begin to soften, causing permanent deformation.
The crest is not smooth, the height on both sides is not parallel, especially when the solder nozzle of the electromagnetic pump crest welder is blocked by oxide, it will appear zigzag shape, which is easy to cause leakage welding and virtual welding.