How to distinguish PCB surface treatment process by color?
PCB surface treatment process is identified by color: 1, gold, 2, silver, 3, light red
PCB surface treatment process is identified by color: 1, gold, 2, silver, 3, light red
PCBA processing common adverse phenomena: 1, warping, 2, short circuit, 3, offset, 4, missing parts, 5, air welding
Design methods to reduce stray capacitance of PCB: 1, remove the inner stratum, 2, use the Faraday shield, 3, increase the space between adjacent trace lines, 4, minimize the use of holes
PCBA processing of aluminum substrate manual soldering wire points for attention: first, pay attention to the welding temperature, two, select the appropriate raw materials, three, with the iron head is harmful to spot welding force
PCB circuit board fault detection methods: 1, determine the fault location, 2, detection equipment, 3, visual and physical detection, 4, special detection components, 5, on the circuit board for detection, 6, low voltage measurement
New design PCB board to find the fault method: 1. Voltage measurement method, 2. Signal injection method, 3. See, hear, smell, touch
Because the printed circuit board has high reliability, high density, strong design, strong production and other unique advantages, a good quality electronic equipment, largely depends on its PCB quality.
Two, the advantages of metal substrate: 1, thermal expansion, 2, heat dissipation 3, dimensional stability, 4, a wide range of applications
What samples should be provided for PCB circuit board proofing? The quotation information needs to be provided to the manufacturer, and the GEBER file is generally provided for the drawings. There are clear process requirements and quantity. The pcb manuf
PCBA processing needs to do three requirements: first, the solder paste, must be stored in 5-10 degrees of environment. In order not to affect the use of solder paste, shall not be placed in the environment below zero, second, in the process of SMT proces
To improve the pass rate of SMT patch processing, the following five process optimization methods are required :1. Improved pcb circuit board steel mesh design;2. Select the appropriate solder paste type; 3. Improve the printing process operation method;
SMT patch processing for the requirements of flux: 1. The appearance of the flux should be uniform, transparent, no foreign matter. 2 viscosity and density than molten solder is small, 4 melting point than solder is low, 5 welding does not produce welding