Analysis of the deformation causes of PCB board in the process of processing: 1. Incoming material of copper clad plate: 2. Pressing: 3. Welding resistance, character and other baking process: 4. Hot air solder leveling: 5. Storage
Single-side backwelding boards are rarely used now, because double-side backwelding can save space on the circuit board, which means it can make the production smaller.
In the process of PCB board copying, since the circuit board needs to be split, the integrated circuit and other components are removed to make BOM list, and the bare PCB board is scanned and copied.
In the actual study, it is found that PCB design mainly has four aspects of interference: power supply noise, transmission line interference, coupling and electromagnetic interference (EMI).
In the design of PCB electromagnetic compatibility, the main problem that needs attention is the interference problem of power supply and ground.
Double-sided PCB is a printed board with conductive graphics on both sides. It is usually made of epoxy glass cloth covered with copper foil board. It is mainly used in equipment with high performance requirements.
In the process of PCBA production, the selection of PCBA transtin is also very important. In the process of through hole plug-in, tin penetration is not good, which is easy to cause problems such as virtual welding, tin cracking and even falling parts.
The PCB processing process from the inner line pattern transfer of PCB substrate to the outer line pattern transfer by pressing several times will cause different growth and contraction of the warp and weft of the jointed board.
Protection measures of multilayer PCB edge radiation: The three elements of EMC problems are: electromagnetic interference source, coupling path, sensitive equipment
When designing the PCB, please note the following points: The shape of a and Mark point is symmetrical up and down or symmetrical left and right, and the size of b and A is 2.0mm. c, from the outer edge of Mark point 2.0mm, there should be no shape and co
Solutions to printing faults in SMT patch processing: 1. There is no gap between the mold and PCB printing mode, which is called "touch printing". Second, the installation should choose the IC installation height of no more than 0.5mm, 0mm or 0~...
The reasons for white spots in PCBA processing are as follows: 1. The circuit board is under inappropriate thermal stress; 2. 2. Due to the influence of mechanical force, part of the resin is separated from the glass fiber, forming white spots; 3. Some PC
