Automatic wiring of PCB
Software vendors and third-party engineers have also tried and failed to achieve acceptable performance improvements.
Software vendors and third-party engineers have also tried and failed to achieve acceptable performance improvements.
The load on the server is lighter than that on the client and therefore does not affect system performance. Tests on this environment show that the server is very responsive and does not slow down the client.
introduces how to realize the PCB wire window on tin, finally describes the PCB design how to set the steps of wire window, follow the small series together to understand.
The specific use of which connection depends on the specific situation. These are the PCB design must understand the content, but also important data. How to partition in PADS is described later in this article.
In this paper, the key is to introduce PCB phosphorus copper ball in detail, the first detailed introduction of PCB electroplating copper need to use phosphorus containing copper ball, followed by the discussion of the use of phosphorus copper ball in PCB
in the design of PCB board, PCB anti-ESD design can be realized by layering, proper layout and wiring and installation. The PCB layout and wiring can be adjusted to prevent ESD.
Aluminum substrate and FR4 board are two common PCB board, aluminum substrate is commonly used as LED lamp board, and FR-4 board is suitable for general circuit design and common electronic products.
PCBA machining circuit board debugging steps and methods: 1. Board surface observation and resistance check, 2. Install components, 3. Detect power supply output voltage, 4. Preset overcurrent protection current, 5. Install and test other modules
Circuit board PCBA processing process can be roughly divided into: empty plate loading - printed solder paste - mounting devices - reflow welding -AOI testing - receiving plate - finished product inspection - parts after welding - circuit board open/short
Four proofing methods of aluminum substrate: one, photographic material proofing method, two, mechanical proofing method, three, electronic proofing method, four, computer aided proofing method
Common bad reasons for PCBA welding resistance film processing :1. Welding pad and through hole connection. 2. Solder resistance design between pad and pad, solder resistance graphic specifications should conform to the design of welding end distribution
The difference between them is that the core is thinner, the pp sheets of one or two layers and five or six layers are thinner, and there is a core board between the core board and the core board without copper foil on both sides, so generally this kind o