The technology and material problems of PCBA solder - free pressing - in connection
The key factors of PCBA crimping technology are as follows: (1) crimping end; ② Printed board; ③ crimping process; (4) Crimping tools and equipment
Контрактное производство электроники под ключ в Китае
Шэньчжэнь, район Баоань, улица Фуюн, улица Фуцяо, район 3, промышленный парк Лонгхуй 6
SMT patch processing technology: Causes of component displacement in patch processing
The reasons for component displacement in patch processing are as follows: 1, the use time of solder paste is limited, 2, the solder paste itself is not sticky enough, 3, the flux content in solder paste is too high, 4, in the process of printing and patc
Reverse deformation mounting of printed circuit board components
During the installation of the reinforced frame and the PCBA, and the installation of the PCBA and the chassis, directly or forcibly install the warped PCBA or the warped reinforced frame and install the PCBA in the deformed chassis.
SMT patch component stele causes and solutions
Factors affecting the printing thickness of solder paste: reduce the thickness of steel mesh plate, is to reduce the amount of solder paste, solder paste melting surface tension will be reduced. When the thickness is reduced, the solder paste is thinner,
5 PCBA processing automation production requirements
5 PCBA processing automation production of PCB size, shape, transmission edge, positioning hole, positioning symbol requirements.
Common quality defects and solutions of reflow welding
The quality of reflow welding is affected by many factors, the most important factor is the temperature curve of reflow furnace and the ingredient number of solder paste in the process of electronic production
SMT factory mounting process quality inspection and analysis
The cleaning quality detection methods of PCBA are as follows: 1. Test methods of ion pollutants: (1) extraction solution resistivity test method, (2) ion chromatography test method
How does SMT plant clean PCB after surface mounting and welding
Significance of PCB cleaning after surface mounting welding: 1. PCB cleaning after surface mounting welding can prevent the occurrence of electrical defects. 2. PCB cleaning after surface mounting and welding can eliminate corrosive substances. 3. The PCB
How can PCB wiring become better
How to improve PCB wiring level: 1, common ground processing of digital circuit and analog circuit, 2, signal wiring on the electrical (ground) layer, 3, connection leg processing in large area conductor, 4, role of network system in wiring, 5, power supp
PCBA machining wash free welding technology
Brief description of SMT patch processing and manufacturing preparation: 1. Engineering, II. Production SMT patch processing: III. Quality, four. Current process: five. New process (optimization)
The key technology of reflow welding machine in SMT patch processing
SMT basic process elements: solder paste printing -> Parts mounting --> Reflow welding --> AOI Optical Detection --> Maintenance --> The board is divided.
Understand the whole process of PCB copying board
Scan the circuit board, record the location of the components in detail, disassemble the components to make a bill of materials and arrange material purchase, and scan the empty board into pictures to process and restore the PCB board drawing file.
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