What are the specifications of Mark processing steps: 1. The processing method of Mark, whether Mark is needed, which side of the template, etc. 2. Which side of the template Mark graphics should be placed according to the specific structure of the printi
Advantages and applications of Anisotropic conductive adhesive (ACA) compared with traditional tin-lead solder: (1) It is suitable for ultra-fine spacing (50um), which is conducive to further miniaturization of packaging. (2) ACA has low curing temperatur
We should start from the design of PCBA lead-free products to consider the compatibility between lead-free materials, lead-free and design, lead-free and process compatibility; Give full consideration to heat dissipation; Carefully select PCB board, pad s
After the design of PCB board, the need to choose the circuit board surface treatment process, the circuit board surface treatment process is now commonly used HASL (surface spray tin process), ENIG (gold process), OSP (oxidation prevention process).
PCB performance test is a necessary test to ensure the stability of product performance after processing. It is divided into different tests according to the actual environment and purpose of product use.
First, scan the circuit board of the copying board, record the location of the components in detail, remove the components to make the BOM, scan the empty board into pictures, process and restore the PCB board drawing file.
The main purpose of solder paste printing technology is to solve the problem of incompatibility with solder paste printing capacity. According to professional statistics, 60% of reworked PCBS are caused by poor solder paste printing.
The demand for multifunctional, miniaturized, high-density, high-performance and high-quality electronic products is increasing. High welding quality has become the life insurance of electronic products.
Circuit boards must use the thinnest coating material to provide maximum protection in order to minimize heat retention, additional weight gain and various other problems.
The latest quotation of PCBA is determined by the following three parts: 1. PCB plate: 2. SMT Patch Processing Plate: 3.
SMT patch proofing and mounting on the space the size of the pinky finger means higher reliability and mounting accuracy, and two great progress can be summarized: first, the number of chip welding pins is reduced, and second, the welding volume is smalle
SMT patch processing basic introduction: high assembly density, small size of electronic products, light weight, high reliability, strong vibration resistance. Low defect rate of solder joint, good high-frequency characteristics, reduce electromagnetic an
