PCB is also known as the Printed Circuit Board (Printed Circuit Board), it can realize the circuit connection between electronic components and function realization, is also an important part of the power supply circuit design.
Maintain the integrity of signal transmission and prevent the "ground projectile phenomenon" caused by the division of ground wire.
How many times is the laser, just a few steps.
To form the pad, the solder shield (insulating layer) forming process is required, as well as to protect the copper foil and provide better insulation.
To introduce the most detailed process of SMT patch:1, PCB board, 2, three anti-paint coating
To introduce the troubleshooting method of short circuit in PCBA processing: Open the PCB design drawing on the computer, pay attention to the IC internal short circuit, three, if found short circuit, it is recommended to take a board secant line, step by
Not paying attention to the packaging of products can bring immeasurable benefits.
Introduce two PCBA packaging technology: 1, plug-in packaging technology, the parts are placed on one side of the board, and the pin is welded on the other side, this technology is called plug-in packaging; 2, surface adhesive packaging technology, the us
Reflow welding has become the mainstream process of surface mounting, it depends on the influence of hot gas flow on the solder joint, colloidal flux in a certain high temperature air flow for physical reaction, achieve SMD welding, the quality of PCBA so
The reason for the appearance of false welding/false welding; 1, solder pad and component pin oxidation, 2, less tin, 3, temperature is too high or too low, 4, low melting point of solder paste, 5, solder paste quality problem,
When PCB is assembled, do not apply any solder to the top or bottom pad. Use screws with built-in washers to achieve tight contact between the PCB and the metal case/shield or ground surface bracket.
The performance of reflow heating process: (1) good wettability, (2) reduce the formation of solder ball, (3) less solder spatter when reflow temperature rises sharply, the solder paste will appear almost boiling phenomenon, causing solder particle spatte
