PCB circuit board function test
Denser PCBS, higher bus speeds, and analog RF circuits pose unprecedented testing challenges that require careful design, thoughtful testing methods, and appropriate tools to provide reliable test results.
Denser PCBS, higher bus speeds, and analog RF circuits pose unprecedented testing challenges that require careful design, thoughtful testing methods, and appropriate tools to provide reliable test results.
In electronic assembly, printed circuit board is a key component. It is equipped with other electronic parts and connected to the circuit to provide a stable circuit working environment.
With increasing frequency, it becomes more and more difficult to control the phase consistency of printed circuit board materials. Accurately predicting the phase change of circuit board materials is not a simple or routine task.
The SMT lead-free process should also be designed and tested in accordance with the principles of simple selection, good quality, short process route, fewer types of process materials and low cost of SMT patch processing
In the production process, it can be prevented in the following ways: 1, moisture-proof storage of components, 2, select good quality solder paste, 3, adjust printing parameters of false welding and false welding problems, 4, control the welding time, 5,
In the manufacturing process of HDI circuit board, there are many defects and difficulties in the process, among which the most important problems are the blind hole sag can not be routed, can not be transferred to form the circuit and so on.
There are two ways to make high-speed circuits work on relatively long lines without serious waveform distortion.
The two major difficulties in the field of microelectronics are the processing of high-frequency signals and weak signals. The same principle design, the same components, different people produced PCB circuit boards will have different results.
With the wide application of wireless communication technology in various fields, high frequency, high speed and high density have gradually become one of the development trends of modern electronic products.
Communicate electronic devices. Military weapon system, as long as there is integrated circuit and other electronic devices, electrical interconnection between them to use PCB, circuit board.
In the PCB surface treatment process, we often confuse several processing processes: gold plating, gold plating and nickel palladium.
The procurement of certain PCB boards is controlled only by the specifications embedded in the Gerber packet. PCB boards can be built from these packets, regardless of mechanical tolerances.