Low temperature co-fired ceramic (LTCC) substrate circuit machining
At present, there are two kinds of metallization methods for LTCC subgrade plate: thick film sintering method and sputtering film plating thickening method.
Контрактное производство электроники под ключ в Китае
Шэньчжэнь, район Баоань, улица Фуюн, улица Фуцяо, район 3, промышленный парк Лонгхуй 6
Low temperature co-fired ceramic (LTCC) substrate
Low temperature co-fired ceramics (LTCC) is a multi-layer ceramic manufacturing technology that integrates interconnection, componentless and encapsulation.
PCB circuit board processing and production difficulty in where?
The high-rise plate is thicker, heavier and larger than the conventional multilayer plate. The corresponding heat capacity is also larger. When welding, more heat is needed and the welding high temperature time is longer.
PCB A balanced laminated design of printed circuit boards
In the core structure, all the conductive layers in the circuit board are coated on the core material; In the foil-coated structure, only the internal conductive layer of the circuit board is applied to the core material, and the external conductive layer
PCB printing
The progress and development of copper clad plate is also driven by the innovation and development of electronic machine products, semiconductor manufacturing technology, electronic installation technology and PCB manufacturing technology. In this case, c
Common PCB board substrate analysis
The properties of the developed substrate materials are provided to the designer of the whole electronic products in time, so that the designer can establish accurate and advanced data basis.
Crosstalk in PCB design
The simultaneous dumping of current underground may temporarily raise the ground's electrical potential, causing a change in reference, a phenomenon known as ground rebound. The main conditions that affect grounding bounce include load capacitance, socket
Circuit board design: PCB size and shape requirements
With the 3D capabilities of the layout tool, designers can interactively handle their component placement in real time and correct all clearance errors in the design's mechanical features.
PCB proofing ceramic substrate production has those processes
The manufacturing process of dry press PCB electronic ceramics mainly includes blank forming, blank sintering and finishing, forming circuit on the substrate.
Blind buried through hole circuit board (HDI circuit board) PCB manufacturing three key
HDI board is one of the most precise PCB board, and its process is also more complex. The core steps include the formation of high precision printed circuit, the processing of micro through hole, the plating of surface and hole.
There are several processes of sun block welding for PCB circuit boards
Sunblock welding process can be roughly divided into three operating procedures:The first step is exposure. The second step is developing. The third operation process repair board.
Design of PCB Roche coil and integral circuit board
In this paper, the design of PCB Roche coil and integral circuit board will be introduced in detail, the frequency characteristics of the system will be analyzed by PSpice simulation software, and the existing experimental conditions will be used to build
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