PCB copying board design and manufacturing is from the subtraction method to addition method, this paper mainly describes the PCB subtraction method and addition method related concepts and manufacturing process, for your reference to learn!
PCB copy board design step two: Draw your own definition of non-standard device package libraryIt is suggested to put the devices drawn by yourself into a dedicated design file of PCB library.
Printed circuit board will appear in almost every kind of electronic equipment, is the basis of the entire electronic products.
There are many procedures to be paid attention to in SMT patch processing, especially solder paste printing. But there are a lot of issues that are important but not being noticed.
The onboard antenna needs to be placed at the edge of the board and where the antenna area is located. Copper foil exclusion zones are required for all layers, and the antenna should be separated from the ground plane of the PCB.
The dimensional stability of multilayer PCB is the main factor affecting the positioning accuracy of the inner layer. The effect of thermal expansion coefficient of substrate and copper foil on the inner layer of multilayer PCB is also considered.
The oxidation of sunken gold plate is the contamination of the gold surface by impurities. The impurities attached to the gold surface change color after oxidation, which leads to the oxidation of the gold surface.
The holes on the circuit board are divided into overcurrent holes, plug-in holes and installation holes.
With the rapid development of electronic communication technology, in order to realize high speed and high fidelity transmission of signals, more and more high-frequency circuit boards are used in communication equipment.
The wiring design of electronic components has more and more influence on whether the test can be carried out well in the manufacture process of PCBA. Here are some important rules and practical tips.
From the point of view of function, the hole can be divided into two categories: one is used as an electrical connection between the layers; The second is used for fixing or positioning devices. If from the process, through the hole is generally divided i
This article is a summary of the author's experience in the actual development, hoping to help many RF IC developers shorten the development cycle, avoid unnecessary detours, save manpower and financial resources
