In the manufacture of high density packaging structure such as BGA for PCB raw materials technical requirements, special analysis should be carried out carefully, the selection of substrate and copper foil thermal expansion coefficient basically to match.
Embedded copper printed circuit board has the characteristics of high thermal conductivity, high heat dissipation and saving board space, which can effectively solve the heat dissipation problem of high-power electronic components.
The small circuit material on the surface of PCB board is copper foil. Originally, copper foil is covered on the whole board, but in the manufacturing process, the middle part is etched away, and the remaining part becomes a network of small lines.
In the typical radiation case of EMC testing and rectification, common-mode voltage parasitic between analog circuit and digital circuit is the main reason for the formation of common-mode radiation.
If the design rules do not meet the requirements of PCB manufacturing process, it will not only affect the function of the product so simple, even can not process can not realize the design intention of the engineer.
thanks to a deep control area and copper plating on the board, produced a bizarre scene during welding, where the board bubbled in layers. Is the processing of the design, or ignoring the welding process, please see today's case analysis.
For any printed circuit board design with two or more circuit layers, electroplated through-holes form an electrical interconnection between the different layers.
High-speed public number are engaged in high-speed PCB design (Layout) of the small partner, signal processing theory may not help these friends in their daily work is not too much, these friends may pay more attention to the topic related to wiring.
Many manufacturers need to customize antenna products to ensure strong signal and stable signal. For antenna customization, we need to pay attention to many details in order to customize the best solution.
Once a PCB laminate problem is encountered, it should be considered to add to the PCB laminate material specification.
Another common problem with EMI generation when PCB wiring is changing the reference plane layer without specifying a closed physical path for the signal PCB routing of the return current.
the traditional physical plate making method is labor-intensive, time-consuming and has low precision, while the chemical rapid plate making method has a controllable precision, but the process is complicated and unfavorable to environmental protection. B
