In the double panel and multilayer plate, in order to connect the printed wires between the layers, a common hole is drilled at the junction of the wires that need to be connected in each layer, that is, through the hole.
The main reason of reflection signal: too long running; Transmission lines with unmatched terminations, excess capacitance or inductance, and impedance mismatches.
Grounding should be added when necessary, two adjacent layers of wiring should be vertical to each other, parallel easy to produce parasitic coupling.
Multilayer circuit board, usually through the hole plate, first board, second board, second stack plate these several. Higher level such as three - level board, arbitrary layer interconnection board usually used very little.
Only when you have all the information is it possible to write test vectors, define component failure styles, or make certain pre-adjustments.
unused gate circuits are often used for design improvements later, and they may be converted into circuits. So it is also important that they are tested from the start to ensure that their artifacts are reliable.
It is best not to use electrolytic capacitors, electrolytic capacitors are two layers of thin film rolled up, this rolled up structure at high frequency performance as inductance, the best use of bile capacitors or polycarbonate gestation capacitors.
It has been proved that the reliability of electronic equipment will be adversely affected even if the circuit diagram is designed correctly and the printed circuit board is not designed properly.
Electromagnetic compatibility (EMC) concerns both the emission and sensitivity of a system. If interference cannot be completely eliminated, it should be minimized. A DSP system is electromagnetic compatible if it meets the following three conditions.
This paper introduces various techniques of the three types of interconnect design, including device installation methods, wiring isolation and measures to reduce lead inductance.
With the development of the electronic industry, the integration degree of electronic components is getting higher and higher, and the volume is getting smaller and smaller, and the BGA type package is widely used.
The production process of high frequency and high speed PCB board is basically the same as that of ordinary PCB board.
