To prevent warping, design engineers must balance the copper pattern on each layer of the circuit board with the area of the circuit. Design engineers must also balance component layout, assembly distribution, and heat distribution to reduce warping.
If the PCB is warped, that is, uneven, the machine's inability to maintain a constant height when releasing the component while placing it on the board affects the accuracy of placement, especially for fine-spaced components.
The main application is the process of small batch trial production to the circuit board factory after the electronic engineer has planned the circuit and completed the production of PCBA, that is, PCBA proofing.
From the development trend of various regions in the world, after large-scale restructuring, migration and technological upgrading, domestic PCB and FPC production and processing enterprises seize the opportunity of transferring electronic products to the
PCB copying board is to scan the circuit board, record the location of the components in detail, and then remove the components to arrange the material purchase, and scan the empty board into pictures, processing and restoring to the drawing file.
The comparison between design and wiring is a major error in the final stage of PCB design. So a number of things need to be checked again, such as device size, hole quality, pad size and review level.
With the continuous improvement of electronic communication technology, more and more traditional circuit board manufacturing methods have been far from meet the rapid development of this era, want to really fast production of high precision, good perform
For designers, our main consideration is the minimum line width of wiring, spacing control and wiring uniformity. Because the spacing is too small will cause the clip film, film can not fade resulting in short circuit.
Therefore, staff should develop the habit of wearing gloves, which can reduce the harm of direct contact with pcb board. The following is a brief introduction of a hand printing will lead to bad pcb board reasons, hazards, and how to avoid.
the tin plating of pcb circuit board is the most prone to problems in the production of the whole circuit board, is the key link affecting the impedance. The biggest defect of electroless tin layer is easy to change color (easy oxidation or delixing), poo
All the technical requirements mentioned above should be prepared before light painting. Such as mirroring, solder expansion, process line, process frame, line width adjustment, center hole, contour line and other issues should be in
Therefore, even for the density is not high, the general number of circuit board, circuit board automatic detection is not only basic, but also economical. In complex circuit board inspection, two common methods are the needle bed test and the double prob
