whether considering from market demand or enterprise development, it is particularly important for PCB system design engineers to complete the design and timely delivery with low cost, fast and efficient.
It is suggested that the signal layer should adopt the positive processing mode, and the power layer and ground layer should adopt the negative processing mode, which can greatly reduce the size of the file data and improve the design speed.
the new 3D Workbench solution Bridges the gap between mechanical and electrical areas, enabling product development teams to quickly and accurately analyze signals across multiple boards.
Power supply noise is directly or indirectly generated from the power supply, to prevent the influence of power supply noise on the circuit, but also to minimize the influence of the outside world or circuit on the power supply.
In the era of HDI high-density connection technology, the line width and line distance will inevitably become smaller and denser, and thus a different type of PCB structure is derived.
In modern high speed digital circuit design, the influence of hole on PCB signal integrity cannot be ignored. In the multilayer plate, the hole can play a good connection role, its parasitic capacitance and inductance can be ignored.
A Blind via is a through-hole that connects the inner layer to the outer layer. The Buried via is a blind hole that connects the inner layer to the inner layer.
Many parameters in the circuit are adjusted by software. The margin of some parameters is too low and in a critical range. When the machine is running in line with the reason for the software to determine the fault, then the alarm will appear.
PCB board surface bubbling may be the problem of poor binding force on the board surface, and then extension is the surface quality of the board.
The crystal vibration does not vibrate during product debugging, which may be due to the crystal vibration device itself or PCB design.
Board bubbling is one of the most common quality defects in PCB production. Because of the complexity of PCB production process and process maintenance, especially in chemical wet treatment, it is difficult to prevent board bubbling defects.
As the frequency of circuits and applications increases, a number of different methods have been developed for determining basic parameters such as material Dk and loss factor (Df).
