What do you know about the welding skills of double-sided PCB?
The wide application of double-sided circuit board has promoted the manufacture of printed circuit board to light, thin, short and small development.
The wide application of double-sided circuit board has promoted the manufacture of printed circuit board to light, thin, short and small development.
In the main PCB circuit boards and components are not possible to increase the price, so the cost is reflected in the link of assembly. : 1, auxiliary materials: tin paste, tin strip, flux, UV glue, through the furnace fixture, 2, smt patch processing, 3,
The following seven factors that will affect welding are summarized: first, welding heating bridge, second, pin welding force, third, choice of soldering iron head, fourth, temperature setting, fifth, use of flux, sixth, transfer welding operation, sevent
Tin beads have serious harm to electronic products, so how to reduce tin beads is one of the key management and control contents of SMT enterprises.
Resistance is the most numerous component in electrical equipment, but it is not the component with the highest damage rate. Resistance damage is most common in open circuit, and resistance increases are rare and resistance decreases are rare.
With the development of miniaturization of electronic products and high-density assembly of circuit board components, SMT production and testing have brought great challenges.
Through hole is one of the important components of multi-layer PCB. From the perspective of function, through hole can be divided into two categories: one is the electrical connection between each layer; The second is the device fixing or positioning.
On the automatic surface mounting line, if the PCB is not smooth, it will cause inaccurate positioning, components cannot be inserted or affixed to the holes of the board and the surface mounting pad, and even crash the automatic inserting machine.
PCB deformation causes can be divided into thermal stress and mechanical stress. The thermal stress is mainly produced in the process of pressing, and the mechanical stress is mainly produced in the process of stacking, handling and baking.
SMT patch factory control method of temperature and humidity sensitive elements: 1, environmental control, 2, process control, 3, control method
The basic process composition of SMT patch processing includes: screen printing (or dispensing), mounting (curing), reflow welding, cleaning, detection, repair screen printing
The main adverse phenomena in the solder paste printing process of SMT patch processing are as follows:After printing, the solder paste is not enough and gradually spreads to the outside of the pad. Reason analysis: 1, the scraper pressure is too large, 2