the new 3D Workbench solution Bridges the gap between mechanical and electrical areas, enabling product development teams to quickly and accurately analyze signals across multiple boards.
Next, I will introduce the research and development process of PCBA products.1. Market research; 2. Prototype and interaction design; 3. Hardware development - main chip confirmation
How to consider the welding process in PCB design? 1. Power line and ground wire should meet the following requirements in PCB design: (1) The power line and ground wire of large area should be drawn into a cross section line; (2) The distribution of copp
The basic working conditions of PCBA patch after processing are as follows: 1. Working conditions: Temperature: 18℃ to 28℃, humidity: 35% ~ 75%; 2. 2. Operation object: all PCbas; 3. Operator: with certain general SMT and DIP welding status identification
Special care should be taken to choose the form and position of segmentation, that is, to make the two better isolation, and do not hinder the flow of driving current and circuit current, with inductance or magnetic bead connection is able to isolate the
As an important part of PCBA, SMT processing has a direct impact on product quality. SMT processing includes multiple processes. How to standardize each process so as to post perfect PCBA
As the complexity of electronic circuits continues to increase, new technologies raise the bar for these products.
Teach you how to choose quality pcb manufacturers:First, look at the product, two, see the application, three, listen to the voice, four, see the reputation, five, see the service
How to improve the SMT patch processing quality?First, select technical personnel, second, ensure the accuracy of equipment, third, set up quality detection control points, fourth, improve the management system, five, formulate rules and regulations
Take your choice of PCB substrate quality：1. Gold plate, 2.OSP plate, 3. Silver plate, 4. Gold plate, 6. Tin-spraying plate
In the era of HDI high-density connection technology, the line width and line distance will inevitably become smaller and denser, and thus a different type of PCB structure is derived.
In modern high speed digital circuit design, the influence of hole on PCB signal integrity cannot be ignored. In the multilayer plate, the hole can play a good connection role, its parasitic capacitance and inductance can be ignored.