scanning acoustic microscope shows its special advantage in nondestructive detection of multilayer high density PCB. And the general obvious explosion plate is only through the visual appearance can be detected.
As the carrier of various components and the hub of circuit signal transmission, PCB has become an important and key part of electronic information products. Its quality and reliability level determine the quality and reliability of the whole equipment.
At present, there are more than 100 layers of PCB, then why do people have "PCB multilayer board why are even layers?" What about this question? Relatively speaking, even layer PCB does have more than odd layer PCB.
It should be noted that the simulation design of optical devices to photoelectric conversion (EO\OE), how to accurately reproduce this conversion process in simulation, requires some experience accumulation.
where the capacitor in the circuit to AC current obstruction effect is called capacitive reactance, inductance in the circuit to AC current obstruction effect is called inductive reactance, capacitance and inductance in the circuit to AC current caused by
With the success of high-speed PCB design, the contribution to EMI has been paid more and more attention. Almost 60% EMI problems can be controlled and solved by high-speed PCB. I have done EMI design for 4 years, and I have some ideas to communicate with
Nowadays PCB design time is getting shorter, smaller and smaller board space, higher and higher device density, extremely demanding layout rules and large size components make the designer's job more difficult.
layout designers must ensure that their work is fully documented and that the final product is ready to be included in the main electronic system of their design.
It is critical for board designers to lay out their boards to create the best possible signal and power integrity. Components shall be placed in a good position for short and direct wiring. At the same time, the boards must be laid out so that all the net
manufacturing technology and system complexity and other key factors have many conflicting requirements, PCB board laminated design is generally considered in various aspects of the key factors after a compromise decision. High - speed digital circuits an
Poor insulation of copper wire will lead to arc between copper wire and copper wire. Too close between the copper trace and the path, it is easy to short-circuit risk; The lack of thickness of the circuit board can lead to bending and breaking.
it is necessary to pay attention to the maintenance order so as to find the shortest path to solve problems, so as to avoid poking and dismantling randomly, which will fail to repair and otherwise lead to greater faults.