The small circuit material on the surface of PCB board is copper foil. Originally, copper foil is covered on the whole board, but in the manufacturing process, the middle part is etched away, and the remaining part becomes a network of small lines.
In the typical radiation case of EMC testing and rectification, common-mode voltage parasitic between analog circuit and digital circuit is the main reason for the formation of common-mode radiation.
If the design rules do not meet the requirements of PCB manufacturing process, it will not only affect the function of the product so simple, even can not process can not realize the design intention of the engineer.
thanks to a deep control area and copper plating on the board, produced a bizarre scene during welding, where the board bubbled in layers. Is the processing of the design, or ignoring the welding process, please see today's case analysis.
High-speed public number are engaged in high-speed PCB design (Layout) of the small partner, signal processing theory may not help these friends in their daily work is not too much, these friends may pay more attention to the topic related to wiring.
Many manufacturers need to customize antenna products to ensure strong signal and stable signal. For antenna customization, we need to pay attention to many details in order to customize the best solution.
If the two reference planes (i.e. the path where the signal returns) have the same potential and the two layers are joined together multiple times through the holes, then the specified return path will have a small loop area. This is the design we wanted.
Once a PCB laminate problem is encountered, it should be considered to add to the PCB laminate material specification.
Another common problem with EMI generation when PCB wiring is changing the reference plane layer without specifying a closed physical path for the signal PCB routing of the return current.
the traditional physical plate making method is labor-intensive, time-consuming and has low precision, while the chemical rapid plate making method has a controllable precision, but the process is complicated and unfavorable to environmental protection. B
whether considering from market demand or enterprise development, it is particularly important for PCB system design engineers to complete the design and timely delivery with low cost, fast and efficient.
It is suggested that the signal layer should adopt the positive processing mode, and the power layer and ground layer should adopt the negative processing mode, which can greatly reduce the size of the file data and improve the design speed.