Advantages and disadvantages of ceramic PCB and its application
Many microelectronic devices (such as accelerometers, gyroscopes, deep ultraviolet leds, etc.) chips are very sensitive to air, moisture, dust, etc.
Many microelectronic devices (such as accelerometers, gyroscopes, deep ultraviolet leds, etc.) chips are very sensitive to air, moisture, dust, etc.
For electronic equipment, a certain amount of heat will be generated when working. If the heat is not dissipated in time, the equipment will continue to heat up, and the devices will fail due to overheating.
High frequency microwave plate forming and printed board, CNC milling is the main. But the method of milling is very different for different materials.
In the high speed signal transmission line of printed board wire, one is the high frequency signal transmission class of electronic products, the other is the high speed logic signal transmission class of electronic products.
1, lead-free solder paste printing, lead-free solder paste printing, 2, small material mounting this process uses the machine is CP machine, 3, large material mounting this process uses XP machine,4, furnace QC, 5, reflow soldering reflow is to melt the s
FHow do you choose a flux?First, combined with product selection, second, according to customer requirements to choose, third, according to the equipment process selection
It is necessary to check regularly whether the power supply on the SMT patch processing line has done all kinds of safety protection, and also to do special training on power supply protection. In the SMT patch processing and production process, it is nec
In PCB design, the hole has four functions: electrical conduction, positioning, heat dissipation, convenient board. It is also divided into pass-through holes and non-pass-through holes. Only PTH holes have pore rings, while NPTH holes have no pore rings.
The learning curve can be made as flat as possible by design reuse of known good circuits. The noisy power supply and those emo receiving chains can no longer be separated. We did everything they asked and more.
Weld the electrode to the pad on the same side as the component. The through hole on the printed board only plays the role of the circuit connecting wire, and the diameter of the hole is determined by the technological level of the metallized hole when th
The expansion and shrinkage of flexible plate materials are mainly related to matrix material PI and glue. The higher the degree of iminization, the stronger the controllability of expansion and shrinkage.
The soft and hard combined board is made of two groups of hard cover plate on the upper and lower surfaces of the circuit board, among which one or more layers of FPC are sandwiched in the middle, and the cover plate area is maintained as no line.