It refers to a way of connecting the circuit board with the outside world, that is, on the board has been soldered gold guide Pin (or Post), in order to remove the skin of the metal wire winding, tightly wound on the tip column to complete the connection.
this method can be used for imaging inspection of the sealing quality of the packaged traditional IC or the densely assembled PCBA. There are two practical models of laser Scan (SLAM) and C-mode scan (C-SAM) on the market.
Ordinary PCB is usually made of copper foil and substrate bonding, and the main material of ceramic substrate is alumina, beryllium oxide, aluminum nitride and other metal oxide ceramics, the performance of the two is quite different.
Soft and hard combined board refers to the combination of soft board and hard board, high frequency board refers to the special circuit board with higher electromagnetic frequency, IC carrier board is a technology.
Halogens are halogens in the periodic table, including fluorine, chlorine, bromine and iodine. Halogen-free board is to replace or replace these harmful elements to achieve environmental protection and non-toxic PCB.
DPC ceramic packaging substrate is also known as direct copper-plated ceramic plate. DPC products have the characteristics of high line accuracy and high surface smoothness.
In a circuit with resistance, inductance, and capacitance, an obstacle to alternating current is called an impedance. Impedance is usually denoted by Z, which is a complex number.
Since 2005, the world's electronic circuit industry technology has developed rapidly, mainly focusing on passive component PCB, inkjet PCB process, laser direct imaging technology, optical technology PCB and nanomaterials in PCB board applications.
PCB multilayer board is the multi-layer line layer, between each two layers is the media layer, the media layer can do very thin.
When the infrared frontal temperature gun is aimed at and close to the distance between the measured object and the tube measured by the sensor, the infrared sensor plate will collect the temperature and convert it into an electrical signal.
In production, we will have the engineering review and approval of your information, if there is a problem the first time to combine with you! In order not to delay your time, the combination form you provide must be accurate.
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