How to solve EMI problem in multi-layer PCB design
Starting from the most basic PCB board, this paper discusses the function and design skills of PCB stacking in controlling EMI radiation.
Starting from the most basic PCB board, this paper discusses the function and design skills of PCB stacking in controlling EMI radiation.
All of these problems can cause the solder shield to detach from the circuit board and eventually lead to corrosion of the copper circuit.
In terms of PCB design, 50 ohm is also selected after comprehensive consideration. In terms of PCB wiring performance, generally low impedance is better.
With the development of large-scale integrated circuit and super-large scale integrated circuit, the multilayer printed board (PCB) will be used more and more.
The circuit working at high frequency should consider the interference between components. The general circuit should make parallel arrangement of components as far as possible to facilitate wiring;
To evaluate the heat dissipation capacity of PCB, it is necessary to calculate the equivalent thermal conductivity (9EQ) of the insulating substrate for PCB, which is composed of various materials with different thermal conductivity.
In the process of PCB high-speed signal circuit design and wiring, engineers need to shorten the lead between the pins of high-speed circuit devices as much as possible.
The microstrip line consists of a fixed length of metal or wire and the whole or part of the ground plane located directly below it.
This means that the board's thermal expansion and contraction can be maintained at a stable limit at higher frequencies and temperatures when the PCB goes through cold, hot and very hot reflow cycles compared to FR4.
Even many electronic design engineers are confused. This material will provide a brief and intuitive introduction to characteristic impedance, hoping to help you understand the rather basic qualities of transmission lines.
the environmental problems involved in PCB production are particularly prominent. The topic of lead and bromine is the hottest, lead-free and halogen-free will affect the development of PCB in many ways.
Take the core component of each functional circuit as the center, and carry out the layout around it. The components should be arranged evenly, neatly and compact on the PCB, and the leads and connections between the components should be reduced and short