In the actual application, according to the application needs to determine whether ESD shielding is needed, when the FPC flexibility requirements are not high, solid copper, thick medium can be used to achieve.
Internal equivalent PCB circuit and application PCB circuit some of the lead out feet are not marked, encounter empty lead feet, should not be grounded without permission,
All of these problems can cause the solder shield to detach from the circuit board and eventually lead to corrosion of the copper circuit. Poor insulation characteristics can cause short circuits due to unexpected electrical connectivity/arcing.
Defective sheeting requires special assembly procedures. If the end-of-life unit board (x-out) is not clearly marked, or it is not isolated from the sheeting, the known defective board may be assembled, wasting parts and time.
According to experience, the effect of RF circuit not only depends on the performance of the RF circuit board itself, but also depends on the interaction with the CPU processing board.
these problems can be avoided. Because the design of the circuit board will vary according to different equipment, different use locations, different heat dissipation requirements, and different electromagnetic interference (EMI) situation, then the desig
As the growth and shrinkage stability of soft plate material is poor, the production of soft plate and pressed PI covering film should be given priority, and the hard plate part should be made according to its growth and shrinkage coefficient.
The main signal line is best concentrated in the center of the PCB board.The clock generator circuit should be near the center of the PCB board, and the clock fan out should be Daisy chain or parallel wiring.
The parasitic capacitance through the hole can cause the signal rise time to be prolonged and the transmission speed to be slowed down, thus deteriorating the signal quality.
It is difficult to use this process to control the production, so process engineers must adopt special flow and parameters to ensure the quality of the plug hole.
Chip products with innovative signal-tuning technologies, such as high-speed backplane interface solutions, can effectively solve these system-level challenges, enabling system vendors to deliver high-performance and scalable systems to their customers, w
The advantage of performing reception equalization in standalone devices is that it provides optimal wiring advantage and design flexibility.
