Generally, there are several ways to deal with analog ground and digital ground: 1, directly separate,2, digital ground and analog ground connected with magnetic beads; 3, digital and analog ground with capacitor connection, using the principle of capacit
The reasons for virtual welding in SMT patch processing are: (1) Virtual welding caused by SMT process factors; (2) Virtual welding caused by PCB factors; (3) Virtual welding caused by component factors; (4) Virtual welding caused by SMT equipment factors
Factors leading to uneven processing of FPC patch: 1. FPC deformation; 2. 2. Thickness and position of attached materials; 3. FPC strengthen the thickness of the plate or the back glue
The main measures to reduce the surface tension and viscosity in PCBA welding process are as follows: (1) increase the temperature, (2) adjust the proportion of metal alloy, (3) increase the active agent, and (4) improve the PCBA welding process environme
In case of tinning, corresponding measures should be taken: 1. Adjust welding process parameters: 2. Replacement of solder alloy: 3. Replacement of components: 4. Check the surface treatment of PCB board and components: 5. Inspection equipment
There may be seven reasons for unrounded solder joints in SMT processing: 1. Slag and bubbles: 2. Improper temperature control: 3. Insufficient welding time; 4. Insufficient soldering tin; 5. Uneven PCB surface: 6. The solder particle is too large: 7. The
The following are four ways to ensure the quality of PCBA processing: 1. Quality control, 2. Inspection and testing, 3. Use high quality raw materials: 4. Professional technical team
PCB board bending or warping is usually caused by: 1. Temperature change: 2. Uneven plating: 3. Uneven PCB board thickness: 4. Improper plate size 5. Uneven welding: 7. Improper PCB board processing: 8. Material problems of PCB board 9. Design problems of
Reflow welding may have some effects on SMT machining quality: 1. PCB deformation caused by temperature gradient; 2. Component damage caused by temperature gradient, 3. Oxidation in reflow welding process
There are five technological means to improve the pass-through rate: (1) optimize the design of steel mesh, (2) select the appropriate solder paste, (3) optimize the printing operation, (4) optimize the temperature curve, (5) adopt tooling and improve the
In order to do a good job in PCBA processing, we need to do the following three things: first, solder paste should be used during SMT processing; second, the SMT equipment must be checked frequently during SMT processing; third, we should always pay atten
Factors affecting SMT processing quality: 1, equipment, 2, technology, 3, PCB circuit board, 4, steel mesh (template), 5, furnace temperature curve setting
