PCBA processing and SMT processing differenceThe whole process of PCBA processing actually includes SMT patch processing. SMT patch processing is only part of the PCBA process, which literally means a wider range of processes
The requirements of the mechanical motion part of the SMT machine are as follows: 1. Design, manufacture and assembly technology of micro, precision and high precision mechanical parts; 2, sports machinery express response, low loss, high efficiency, prec
Key points of solder paste printing technology: 1, the Angle of the printing press scraper and steel mesh, 2, scraper pressure, 3, scraper speed, 4, printing gap, 5, release speed
Then SMT patch processing plant will generally do what reliability test of PCBA board: 1, push and pull test: 2, FCT test: 3, fatigue test: 4, ICT test: 5, simulation of automobile transportation vibration test: 6, environmental test test: 7, aging test
Chip production process: 1, silicon purification to make wafers, 2, wafer coating, 3, wafer lithography development, etching, 4, mixed with impurities, 5, wafer testing, 6, chip packaging, 7, testing, packaging
Wiring is generally divided into three levels: one is the layout, which is the most basic requirements of PCB design, the second is to meet the electrical performance, which is the standard to measure whether the circuit board is qualified. Three is beaut
Due to the high temperature pyrolysis of the organic matter in the flux, it is difficult for the air bubbles to escape, resulting in the gas being wrapped in the alloy powder. From the process can be seen, organic matter by the heat produced by the main w
The purpose of testing PCB board is to find out the defects of PCB board and repair them to ensure the production quality of PCB board and improve the qualified rate of products.
PCB production is divided into: layout → core board production → inner layer layout transfer → drilling and inspection → lamination → drilling → copper chemical precipitation → Outer layer layout transfer → computer control and copper plating.
In PCB board production, only two steps will use film stripping. D/F stripping after etching of the inner line and D/F stripping before etching of the outer line (if the outer line is made into a negative film process).
Effective techniques to improve PCB design spread rate and design efficiency: first, PCB board size and wiring layer number need to be determined in the early design, second, automatic wiring tool itself does not know what should be done, third, in the la
Common pads are: 1, square pad, 2, round pad, 3, island pad, 4, polygonal pad, 5, oval pad, 6, open shape pad
