What inspection should be done before SMT patch processing?
What inspection should be done before SMT patch processing: first, SMT patch components inspection, second, printed circuit board (PCB) inspection, third, SMT patch processing precautions
What inspection should be done before SMT patch processing: first, SMT patch components inspection, second, printed circuit board (PCB) inspection, third, SMT patch processing precautions
Note for circuit board welding: 1, after getting the PCB bare board, first check the appearance; 2, after the materials required for circuit board welding are complete; 3, when selecting components for welding, welding should be carried out in the order o
The causes of SMT printing leakage and tin deficiency are as follows: 1. Tin paste printing principle, 2. Observation, thinking, comparison, 3. Bare copper plate printing verification
Materials for PCBA electronic products patch processing: 1. Complete PCB board making file and board making requirements; 2. 2. Complete BOM, 3. PCBA assembly drawing, PS: report the cost of PCBA function test, and provide the method of PCBA function test
SMD materials must be exquisite, not ready for SMT patch proofing. There are still some problems with SMD materials, from the quantity of incoming materials to the specific specifications and parameters of the materials, we must pay attention to, so that
PCBA in the manufacturing need to consider the issues :1, automatic production line veneer transmission and positioning elements design,2, PCBA assembly process design,3, component layout design,4, assembly process design
The warping of PCB circuit boards has great influence on the production of printed PCB circuit boards, and warping is one of the important problems in the production process of PCB circuit boards. Bent, component foot is difficult to clean.
One of the causes of PCB warping is that the substrate used may warpage, but in the process of PCB processing, due to thermal stress, chemical factors, and improper production process will also cause PCB warpage.
Failure analysis is an important part in the reliability of SMT electronic assembly process. It is necessary to have certain testing and analysis equipment to carry out the failure analysis of electronic process.
PCBA processing wave welding notes :PCBA after wave welding, cleaning board, storage and maintenance may be white around the pad. The white stuff is mostly residue
SMT factory layout and location requirements: 1, fire extinguisher placement area, 2, material rack car placement area, 3, material preparation table placement area, 4, printing station table placement area, 5, tin paste placement area, 6, after the furna
In PCB production, the circuit board also needs to be tested to see whether the circuit is open, short circuit phenomenon. This works as a needle bed, testing against each network point