At the same time, physical and chemical changes are formed on the surface of the functional groups of the gas composition, so as to improve the bonding force of copper plating, pollution removal and other plate loading effects.
The most effective way to increase PCB density is to reduce the number of through-holes and precisely set blind and buried holes to achieve this requirement, resulting in the HDI board.
It is a test method in which the assembled plate is supported by two cross bars from the outside of the lower plate surface, and then pressed down from the third point of the upper center to form a plate bend, and then the strength of each solder joint is
That is to say, in a specific storage environment, the quality of the goods must be able to continue to meet the requirements of the specification, and ensure that in the way of use, not because of storage time is too long and failure situation, this can
HDI board is one of the most precise PCB board, and its process is also more complex. The core steps include the formation of high precision printed circuit, the processing of micro through hole, the plating of surface and hole.
Generally practical oxidation in the narrow sense refers to the reaction of direct combination with oxygen. The rusting of various metals, for example, is oxidation. Oxides also refer to various oxides produced, while Oxidizing Agent refers to oxidizing a
general solid insulation material is not easy to fill the dead corners, and where the need to be closely matched, such as high-voltage cables, transformers, small capacitors, can be filled with mineral oil, ethylene glycol and carbon chloride, as liquid i
Sunblock welding process can be roughly divided into three operating procedures:The first step is exposure. The second step is developing. The third operation process repair board.
must try to be dispersed or diluted or offset, in order to maintain the good operation and performance of the machine. Available methods such as air convection cooling, add heat sink, or set up a variety of refrigerant pipelines, are called heat dissipati
It refers to a way of connecting the circuit board with the outside world, that is, on the board has been soldered gold guide Pin (or Post), in order to remove the skin of the metal wire winding, tightly wound on the tip column to complete the connection.
this method can be used for imaging inspection of the sealing quality of the packaged traditional IC or the densely assembled PCBA. There are two practical models of laser Scan (SLAM) and C-mode scan (C-SAM) on the market.
The measurement method is to dissolve the sample in hot alcohol with titanium phenol as an indicator, titration required potassium hydroxide milligram number, namely its acid value.