The most critical problem is not to cross the divide gap wiring, once across the divide gap wiring, electromagnetic radiation and signal crosstalk will increase sharply. The most common problem in PCB design is EMI problem caused by signal lines crossing
The gold plating of the plug is hard gold, wear-resistant, pluggable hundreds of times, requiring that the gold layer has a certain hardness, and the gold liquid in the gold groove contains trace cobalt (nickel, antimony) elements.
Automated testing is essential to validate the manufacture of printed circuit boards. The bare board test will check that the wood-based board has good connectivity, while the ICT and fly pin tests will verify the board assembly and welded connections.
Now there are many ways to layer, there are potions corrosion, tool stripping, but it is easy to put the layer over, lost data. Experience tells us that sandpaper is the most accurate.
the general double panel copying board is much simpler than the multi-layer copying board, multi-layer copying board is prone to inaccurate situation, So the multilayer board copy board to be particularly careful and careful (which internal through holes
the dielectric constant is small, can be used in high frequency. If applied to the electronic communication industry, it can greatly reduce the signal loss rate. The price of ordinary PCB board on the market will vary according to different materials.
The procurement of certain PCB boards is controlled only by the specifications embedded in the Gerber packet. PCB boards can be built from these packets, regardless of mechanical tolerances.
Although the miniaturization trend makes it more challenging, it is possible to use multiple connector groups on two PCB boards by using best design practices.
Chip-on-chip (WCSP) or core-sized ball grid arrays (DSBGA) use fine-pitch wire bonding and flip-chip interconnection, and are available in SiP, modular, stacked and recessed core-based formats.
The high-rise plate is thicker, heavier and larger than the conventional multilayer plate. The corresponding heat capacity is also larger. When welding, more heat is needed and the welding high temperature time is longer.
In the core structure, all the conductive layers in the circuit board are coated on the core material; In the foil-coated structure, only the internal conductive layer of the circuit board is applied to the core material, and the external conductive layer
The progress and development of copper clad plate is also driven by the innovation and development of electronic machine products, semiconductor manufacturing technology, electronic installation technology and PCB manufacturing technology. In this case, c