Why should PCB circuit board sink gold and gold plating, what is sink gold and gold plating
The most fundamental difference between gold plate and gold plate is that gold is hard gold (wear-resistant), gold is soft gold (not wear-resistant).
The most fundamental difference between gold plate and gold plate is that gold is hard gold (wear-resistant), gold is soft gold (not wear-resistant).
PCB=Printed Circuit Board ; PCBA=Printed Cirruit Board +Assembly.That is to say, PCB empty board through SMT, and then through the DIP plug-in of the whole process, referred to as PCBA.
Failure to provide sufficient time and effort for the PCB layout and wiring phase of the design can lead to problems in the manufacturing phase or functional deficiencies as the design moves from the digital domain to the physical reality.
Precautions for applying three anti - paint:1, can not let the PCB circuit board surface dripping, fluid paint, semi-humid phenomenon, 2, should ensure that the three anti paint uniform, bright, smooth, 3, can not let the surface of the paint layer of pin
Introduce two PCBA packaging technology: 1, plug-in packaging technology, the parts are placed on one side of the board, and the pin is welded on the other side, this technology is called plug-in packaging; 2, surface adhesive packaging technology, the us
First, the difference between rework and maintenance, second, rework process objectives.1, controllable, reliable, repeatable process, which can be adjusted when necessary, 2, efficient process, can be quickly and easily carried out in the production envi
After determining PCB related selection factors, the payment method should be selected, including whether to issue bills, express logistics, packaging type and flying needle test. If there are special requirements, the information should be noted.
The plate with higher Tg can increase its ability to withstand stress and deformation, but the price of the material is relatively high.
The reason for the appearance of false welding/false welding; 1, solder pad and component pin oxidation, 2, less tin, 3, temperature is too high or too low, 4, low melting point of solder paste, 5, solder paste quality problem,
In PCB production process, in addition to pressing, there are several high temperature treatment processes, such as welding resistance, characterization and hot air smoothing.
Basically, V-Cut is the culprit of damaging the structure of the board, because V-Cut is in the original a large sheet of the board to cut out grooves, so the V-Cut place is prone to deformation.
When PCB is assembled, do not apply any solder to the top or bottom pad. Use screws with built-in washers to achieve tight contact between the PCB and the metal case/shield or ground surface bracket.