On the automatic surface mounting line, if the PCB is not smooth, it will cause inaccurate positioning, components cannot be inserted or affixed to the holes of the board and the surface mounting pad, and even crash the automatic inserting machine.
PCB deformation causes can be divided into thermal stress and mechanical stress. The thermal stress is mainly produced in the process of pressing, and the mechanical stress is mainly produced in the process of stacking, handling and baking.
In any switching power supply design, the physical design of the PCB board is the last link. If the design method is not correct, the PCB may radiate excessive electromagnetic interference, causing the power supply to work unstable.
PCBA is one of the basic components of electronic components, PCB it through surface assembly technology (SMT), and the whole process of DIP plug-in insertion, known as PCBA process.
The basic process composition of SMT patch processing includes: screen printing (or dispensing), mounting (curing), reflow welding, cleaning, detection, repair screen printing
Several parts of the circuit board are mainly: 1. Bare copper plate: 2. Gold plate: 3. Spray tin circuit board: 4. OSP process board is also called organic welding film in SMT factory.
In the future, the application of KPI will become more and more important and will become an objective basis for the improvement and evaluation of intelligent manufacturing related projects.
From PCB design to the completion of welding of all components into a high quality circuit board, PCB design engineers and even the level of welding process, welding workers and many other links have strict control.
The size of electronic devices is also getting smaller, which requires that the heat dissipation device itself should have certain heat dissipation conditions, and the heat dissipation device itself should also have certain heat dissipation conditions.
Engineers in the whole process of PCB design, in order to save time all want to ignore the table bottom of the whole board laying copper this link.
In the process of PCB production, the physical and chemical properties of each material are different, and the thermal stress residual generated in the pressing process leads to the bending and warping of the board.
Because the copper plating is not satisfied, the hole inside is empty, so it can not be directly punched on the above, to stagger a certain distance, and then hit a layer of empty.