How to design pcb window opening
introduces how to realize the PCB wire window on tin, finally describes the PCB design how to set the steps of wire window, follow the small series together to understand.
Контрактное производство электроники под ключ в Китае
Шэньчжэнь, район Баоань, улица Фуюн, улица Фуцяо, район 3, промышленный парк Лонгхуй 6
In PCB design "ground" division and processing method
The specific use of which connection depends on the specific situation. These are the PCB design must understand the content, but also important data. How to partition in PADS is described later in this article.
PCB does not need to use phosphorus containing copper ball _ phosphorus copper ball in PCB application overview
through the titanium electrode rolling plating method to carry out the first and second rolling plating, improve the thickness of the copper layer to enhance the actual effect of the conductivity of the guide hole.
Explain in detail the PCB design of phosphorus copper ball
In this paper, the key is to introduce PCB phosphorus copper ball in detail, the first detailed introduction of PCB electroplating copper need to use phosphorus containing copper ball, followed by the discussion of the use of phosphorus copper ball in PCB
Harm of phosphorus moisture content in Pcb to anodized phosphorus film
the control of hydrochloric acid concentration value need not be slightly lower, the current intensity is slightly higher, not only the amount of the area and hemp sand can be defeated.
How to reduce ESD interference in PCB design process
in the design of PCB board, PCB anti-ESD design can be realized by layering, proper layout and wiring and installation. The PCB layout and wiring can be adjusted to prevent ESD.
The debugging procedure and method of PCBA machining circuit board
PCBA machining circuit board debugging steps and methods: 1. Board surface observation and resistance check, 2. Install components, 3. Detect power supply output voltage, 4. Preset overcurrent protection current, 5. Install and test other modules
Circuit board PCBA processing process is introduced
Circuit board PCBA processing process can be roughly divided into: empty plate loading - printed solder paste - mounting devices - reflow welding -AOI testing - receiving plate - finished product inspection - parts after welding - circuit board open/short
How to reduce the surface tension and viscosity in PCBA welding
Pay attention to the wiring of signal lines under the magnetic beads, between the pads and those that may come into contact with the magnetic beads. Some magnetic beads conduct electricity quite well and may produce unexpected conductive paths.
PCB punching common defects and solutions
Ensure the machining accuracy and assembly accuracy of guide column and guide sleeve; Reduce the fit gap between the shape of pusher plate and the die, and make the shape of pusher plate consistent with the concave and convex shape.
Reasons for indented design of GND layer and power layer in multi-layer PCB design
Only under certain conditions can the 20H principle have obvious effects. 1. The power plane shall be located inside the PCB, and the upper and lower layers adjacent to it shall be 0V planes, and the distance between the two 0V planes shall be at least 20
PCBA processing welding resistance film common causes of bad
Common bad reasons for PCBA welding resistance film processing :1. Welding pad and through hole connection. 2. Solder resistance design between pad and pad, solder resistance graphic specifications should conform to the design of welding end distribution
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