The basic factors of determining perfect wave soldering in PCBA processing
Factors that determine perfect wave soldering in PCBA processing include: 1. Stable complete contact; 2. heat
Factors that determine perfect wave soldering in PCBA processing include: 1. Stable complete contact; 2. heat
To ensure service quality, we will check all SMT processing and DIP welding processes :1. PCB factory inspection,2. High temperature baking before production,3. 3D AOI solder paste printing inspection,4. Optimal cost accounting,5. Technical feasibility st
The advantages of PCBA processing are: 1. Mass PCBA processing and assembly - complete equipment, 2. Our source of PCBA quality assurance, 3. Low cost PCBA one-stop supply chain management, 4. PCBA expert team
How to cleverly design multiple circuits of the same circuit structure quickly: 1. Design code segments (code segments), 2. Equipment Table, 3. Multi-channel design method (Multi-channel)
Test methods that can be used to identify counterfeit electronic parts in routine operations: first, visual inspection, second, electrical testing, third, X-ray inspection, fourth, XRF technology
When PCBA is processed in the furnace: Because the pin of the plug-in element is scour by tin flow, some plug-in elements will be tilted after welding in the furnace, resulting in the element body beyond the screen frame, so it is required to repair weldi
Here are some possible reasons for potential growth: 1. PCB solder resistance details; 2. Surface treatment; 3. Screen printing; 4. Impedance details: 5
General items to be checked after PCB wiring include: General PCB design drawing check items, PCB physical characteristics, PCB installation requirements, PCB electrical characteristics, PCB mechanical design factors, PCB removal requirements, PCB electri
The main reasons for solder joint failure in PCBA processing are as follows: 1, component pin is bad: 2, PCB solder pad is bad: 3, solder quality defects: 4, solder quality defects: 5, process parameter control defects: 6, other auxiliary materials defect
Methods for rapid maintenance of faults after PCBA processing: one, visual inspection method, two, resistance method, three, voltage method, four, waveform method, five, current method, six, component replacement method, seven, step by step investigation
When the solder paste reaches the melting temperature, under the action of balanced surface tension, there will be a self-positioning effect, that is, when there is a small deviation from the component placement position, under the action of surface tensi
pcba electronic products processing process: one, customer data file, two, document review, three, technical preparation, four, material purchase and arrival, five, material inspection and machine, six, start production, seven, test and delivery