When designing and wiring PCB, it is required to do as much as possible:1. If the wiring space permits, insert a ground wire or ground plane between the two lines with serious crosstalk, which can isolate and reduce crosstalk. 2. When electromagnetic fiel
The performance of PCB board is determined by the material used (high Q value), wiring design and several layers of board. The quality of PCB board has nothing to do with PCB color
PCBA processing on the workshop environment specific requirements: one, temperature, humidity requirements, two, ventilation capacity, three, power requirements, four, electrostatic protection requirements
Common mistakes in PCB design process are summarized as follows: 1. Pad overlap; 2. Non-standard use of graphic layer; 3. Characters unreasonable, 4. Single side pad set aperture, 5. Use filler block to draw pad, 6. The electric stratum is designed with b
PCBA batch processing success of the four secrets: one, planning in advance, two, looking for suppliers, three, evaluation of capacity and capacity, four, trust your suppliers
There are five common principles in PCB design: component arrangement rules, according to the signal direction layout principle, electromagnetic interference prevention principle, thermal interference suppression principle, adjustable component layout pri
PCBA processing requirements for PCB board; 1, PCB size,2, PCB board side width,3, PCB bending,4, PCB board Mark point,5, PCB welding pad
The process process of PCBA can be roughly divided into four main links: SMT patch processing →DIP plug-in processing →PCBA testing → finished product assembly
This confusion has always existed in norms, standards, discussions, and documents. People think of stability tests as reliability tests, when in fact they are durability tests.
These Tier 1 suppliers have decades of experience in the automotive sector, and given that they are ultimately financially responsible for reliability, they do a lot of work in modeling.
This applies not only to the interconnection and isolation of circuit boards, but also to the high frequency testing of circuit boards, because the material will change its electrical characteristics after undergoing the component welding process.
According to the welding pad surface treatment classification: organic weldability protection layer (OSP), nickel metal leaching (ENIG), nickel palladium leaching (ENEPIG), silver Immersion silver, tin immersion.