The PCB process design requirements are introduced in detail: 1, test point addition, 2, optical location point, 3, add working edge, 4, film file output, 5, plate rules, 6, board information annotation
Common pads are: 1, square pad, 2, round pad, 3, island pad, 4, polygonal pad, 5, oval pad, 6, open shape pad
We should not only master various maintenance methods and analysis methods, but also learn and use them flexibly. To be calm, to work hard, to guard against arrogance and impetuous, to maintain a common heart, to make a difference.
PCB design impedance matching: PCB design impedance matching refers to a suitable collocation between the signal source or transmission line and the load. According to the access mode PCB design impedance matching has serial and parallel two ways; Accordi
First, clean the cured photosensitive film on the PCB. It is then cleaned of excess copper foil covered with a strong alkali. The tin coating on PCB layout copper foil is then removed with destin solution. After cleaning, complete the 4-layer PCB layout.
Polygon filling deviation usually occurs when polygon plating copper on multi-grid circuit boards. While it does not have a standard based on a single grid, it can provide service beyond the required life of the boards.
PCB board depends on science and technology, naturally must not lag behind, so the layout of high frequency PCB has become the key point to discuss when we design PCB high frequency board.
PCBA proofing operation process :1. Customers place orders; 2. Customers provide production materials; 3. Purchased raw materials, 4. Incoming material inspection, 5. PCBA production, 6. PCBA testing, 7. After packaging
SMT can greatly reduce production time. Moreover, SMT components can be placed in the thousands per hour, compared to less than a thousand for through-hole installations.
PCBA in the manufacturing need to consider the issues :1, automatic production line veneer transmission and positioning elements design,2, PCBA assembly process design,3, component layout design,4, assembly process design
The warping of PCB circuit boards has great influence on the production of printed PCB circuit boards, and warping is one of the important problems in the production process of PCB circuit boards. Bent, component foot is difficult to clean.
PC8 production is not difficult, the difficulty lies in the production of fault troubleshooting. Whether it is an individual hobbyist or an industry engineer, it is quite troublesome to encounter problems when debugging PCB circuit boards.