Then SMT patch processing plant will generally do what reliability test of PCBA board: 1, push and pull test: 2, FCT test: 3, fatigue test: 4, ICT test: 5, simulation of automobile transportation vibration test: 6, environmental test test: 7, aging test
Wiring is generally divided into three levels: one is the layout, which is the most basic requirements of PCB design, the second is to meet the electrical performance, which is the standard to measure whether the circuit board is qualified. Three is beaut
Due to the high temperature pyrolysis of the organic matter in the flux, it is difficult for the air bubbles to escape, resulting in the gas being wrapped in the alloy powder. From the process can be seen, organic matter by the heat produced by the main w
Whether in the manufacturing and assembly process or in actual use, PCB to have reliable performance, this is very important.
In short, PCB manufacturing is a complex, long project, need to comply with a lot of rules and regulations, to ensure the normal operation of machinery and equipment, to ensure that improve the work efficiency and yield.
The high floor board uses high TG, high speed, high frequency, thick copper, thin dielectric layer and other special materials, which puts forward high requirements for the inner line fabrication and graphic size control.
The purpose of testing PCB board is to find out the defects of PCB board and repair them to ensure the production quality of PCB board and improve the qualified rate of products.
PCB production is divided into: layout → core board production → inner layer layout transfer → drilling and inspection → lamination → drilling → copper chemical precipitation → Outer layer layout transfer → computer control and copper plating.
In PCB board production, only two steps will use film stripping. D/F stripping after etching of the inner line and D/F stripping before etching of the outer line (if the outer line is made into a negative film process).
By using SMT, the PCB does not need to be drilled into it. Instead, what they do is they use solder paste. In addition to adding a lot of speed, this simplifies the process significantly.
Effective techniques to improve PCB design spread rate and design efficiency: first, PCB board size and wiring layer number need to be determined in the early design, second, automatic wiring tool itself does not know what should be done, third, in the la
Considering the performance and processing efficiency of PCB, the preferred process sequence is as follows: 1. If the component surface is mounted on one side, it is formed by reflow welding; 2. 2. If the component surface patch and plug-in are mixed: one