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PCB

Eliminate RF current in PCB

When we combine the forward - clock - oriented field and the reverse - clock - oriented field, the effect of elimination can be produced.

Cause and influence of emi in pcb

The above examples can help us understand Maxwell equations and PCB routing, and they are illustrated by very simple mathematical formulas.

The cause of electromagnetic interference in PCB and the technique of eliminating interference

In PCB, EMI can be produced for many reasons, such as: RF current, common mode level, ground loop, impedance mismatch, magnetic flux

Why is the common PCB board thickness 1.6mm

as PCB substrate epoxy resin (see the column of PCB substrate resin chapter), PCB substrate reinforcement materials, copper foil and other manufacturing technologies have not realized commercial production.

PCB board, the rules are very particular

Otherwise, you may be forced to make modifications and redesign your PCB stack structure.

Exposed pad on PCB

In addition, with the increase of width, PCB current-carrying capacity does not increase strictly in line with the linear increase

Cause analysis of PCB board defects

This will break the solder joints, bend the shape of the board, or it may cause the copper thread on the board to break.

How to do the precision of PCB circuit board "extreme"?

This technology has become a necessary means of detection in fine wire production, and is being rapidly popularized, applied and developed.

Why are PCB design layers mostly even?

the following methods can be used to balance the cascade, reduce the cost of PCB production and avoid PCB bending.

Understand PCB laminated design

It is important to note that the power layer should be near the layer that is not the main component plane, because the bottom plane will be more complete. Therefore, EMI performance is better than the first scheme.

PCB circuit board cooling skills

the thermal performance index analysis software module added in some professional PCB design software can help designers optimize circuit design.

The material that can make high speed PCB should meet these 5 requirements

Choose as large a component as possible when designing the power resistance, and adjust the layout of the printed board to allow enough space for heat dissipation.

Достаточно загрузить файлы Gerber, BOM и проектные документы, и команда KINGFORD предоставит полное предложение в течение 24 часов.