the environmental problems involved in PCB production are particularly prominent. The topic of lead and bromine is the hottest, lead-free and halogen-free will affect the development of PCB in many ways.
Therefore, careful consideration should be given to the placement of ground wires in the layout. Mixing all kinds of ground will cause unstable power supply. The following points should be noted in the design of ground wire:
Take the core component of each functional circuit as the center, and carry out the layout around it. The components should be arranged evenly, neatly and compact on the PCB, and the leads and connections between the components should be reduced and short
The parameters of PCB board layer, the distance between signal wires, the electrical characteristics of the driver and receiver end, and the connection mode of signal wires all have a certain influence on the crosstalk.
All of these problems can cause the solder shield to detach from the circuit board and eventually lead to corrosion of the copper circuit. Poor insulation characteristics can cause short circuits due to unexpected electrical connectivity/arcing.
Defective sheeting requires special assembly procedures. If the end-of-life unit board (x-out) is not clearly marked, or it is not isolated from the sheeting, the known defective board may be assembled, wasting parts and time.
According to experience, the effect of RF circuit not only depends on the performance of the RF circuit board itself, but also depends on the interaction with the CPU processing board.
these problems can be avoided. Because the design of the circuit board will vary according to different equipment, different use locations, different heat dissipation requirements, and different electromagnetic interference (EMI) situation, then the desig
Even if the oxidation after a long time of use will almost only occur in the insertion and removal of the connection part, and there is no impact on the welding pad and the welded components.
As the growth and shrinkage stability of soft plate material is poor, the production of soft plate and pressed PI covering film should be given priority, and the hard plate part should be made according to its growth and shrinkage coefficient.
There are many factors causing the coating cavity, the most common is PTH coating cavity, by controlling the relevant process parameters of the potion can effectively reduce the generation of PTH coating cavity.
The main signal line is best concentrated in the center of the PCB board.The clock generator circuit should be near the center of the PCB board, and the clock fan out should be Daisy chain or parallel wiring.