The functional design requirements of electronic products are higher and higher, but students' requirements for volume are smaller and smaller. This requires the IC chip size to be smaller and smaller, the degree of complexity and enterprises continue to
the best way to solve the heat dissipation is to improve the heat dissipation capacity of PCB aluminum substrate in direct contact with the heating element, through the PCB board to conduct out or send out.
PCB is one of the important components of the electronic industry, the industrial output value accounts for about a quarter of the total output value of electronic components, the largest proportion in each electronic component subdivision industry
Because the aluminum base material has excellent cooling effect, the heat dissipation in the circuit process is evaporated in time, prolong the service life of components, so that the circuit is more stable and durable.
With the continuous improvement of electronic communication technology, more and more traditional circuit board manufacturing methods have been far from meet the rapid development of this era, want to really fast production of high precision, good perform
Rapid PCB fabrication is a technique that allows you to make hardware development as easy as software development. Master it, can get twice the result with half the effort.
the degree of automation of industrial equipment is getting higher and higher, so the number of industrial control board in various industries is also increasing. After the industrial control board is damaged, the high cost required to replace the circuit
The chemical residue in the gold settling process can be left in the hole where the plug hole is not sufficient, causing problems such as weldability. Moreover, tin beads may be hidden in the hole, which may splash out during assembly or actual use, causi
To prolong the life of devices and prevent failures, effective heat transfer management is very important. Overheating conditions on the board can not only speed up the failure mechanism, but also cause the device to become too hot to handle and in some c
There is no doubt that condensation will severely test the insulation resistance of the coating. There are many coating products that can withstand this kind of test, so you can avoid these problems by choosing the right materials at the beginning of the
its melting point is much higher than that of the tin solder, which results in the reduction of the weldability of the surface of the welding pad, and the non-wetting of the welding pad and the solder climbing to the welding end of the device are easy to
A total of four BGA were dyed. After the BGA was pulled apart, it could be seen that most of the solder joints were pulled apart from the joint of PCB pad and substrate, and some were pulled apart from the side of pad, but there were holes.
