This is done by making multiple design changes to a small number of boards and then testing all variants before the next manufacturing run. These variants are for assembly only, and all bare plates are manufactured in a similar manner.
bottom solder layer top solder layer drill guide, multilayer mechanical layer is to define the appearance of the entire PCB board, in fact, when we say the mechanical layer is referring to the overall structure of the PCB board.
Some circuit board shape is special, different shape, through the board can be more effective use of PCB substrate area, reduce waste, save costs.
This article will effectively take you through the stages of the printed circuit board design process, but will focus more on the etching and stripping process of the board.
Positioning holes on printed circuit boards should be represented by special graphic symbols. When the requirements are not high, the printed circuit board can also be used in the larger assembly hole instead.
There are several parameters to consider when designing PCBS for high frequency applications. This article discusses these factors, as well as the application of high frequency printed circuit boards.
The manufacturing process of printed board is still more complex, to go through the light painting, photographic plate and other chemical processes, consume more materials, longer cycle, high cost.
it is worth familiarizing yourself with the preferred material for a particular number of layers and making every effort to design a PCB to match it. There will always be exceptions to specific design requirements, but in general, standard materials are t
This is because the pad will likely be rectangular, which means that the average PCB assembler will consider applying the paste in this shape as optimal.
A protective coating is a polymer film applied to the PCB surface to protect the PCB board and its components from corrosion and environmental contamination.
The temperature resistance test of PCB circuit boards is to prevent adverse reactions such as board bursting, foaming and delamination at excessively high temperature, leading to poor product quality or direct scrap, which is a problem that needs to be pa
In the end, the manufacturer will have to discard the defective board or accept costly and time-consuming repairs that may not have a clear answer to the root cause of the defect.
