In-depth interpretation of SMT technology
SMT is an electronic circuit production technology where components are mounted or placed directly on the surface of a printed circuit board. In this industry, there are two methods: SMD and THT.
Контрактное производство электроники под ключ в Китае
Шэньчжэнь, район Баоань, улица Фуюн, улица Фуцяо, район 3, промышленный парк Лонгхуй 6
The four major factors of achieving the goal of high reliable quality
Set up relatively complete electrical equipment process specifications, including specifications for PCB circuit design and manufacturing specifications, establish the corporate culture of manufacturability design.
Printed circuit board components are the core concept of DFM
Circuit designers and technicians of products must master and follow PCBA manufacturability design procedures. Following PCBA manufacturability design procedure is the first prerequisite for product manufacturability design.
PCB does not need to use phosphorus containing copper ball _ phosphorus copper ball in PCB application overview
through the titanium electrode rolling plating method to carry out the first and second rolling plating, improve the thickness of the copper layer to enhance the actual effect of the conductivity of the guide hole.
Harm of phosphorus moisture content in Pcb to anodized phosphorus film
the control of hydrochloric acid concentration value need not be slightly lower, the current intensity is slightly higher, not only the amount of the area and hemp sand can be defeated.
PCB punching common defects and solutions
Ensure the machining accuracy and assembly accuracy of guide column and guide sleeve; Reduce the fit gap between the shape of pusher plate and the die, and make the shape of pusher plate consistent with the concave and convex shape.
PCBA processing lecture hall: the common heat dissipation of circuit board
Common heat dissipation mode of circuit board: 1, high heating device plus radiator, heat conduction plate, 2, through the circuit board itself heat dissipation, 3, the use of reasonable design to achieve heat dissipation function, 4, for the use of free
Solder paste printing quality process parameters
When printing plate is printing solder paste, there is a certain restrictive relationship between scraper speed, scraper pressure, scraper and mesh plate Angle, release speed and solder paste viscosity.
Electrostatic protection method in PCBA processing and production
In PCB processing and production, static electricity is not the hazard, the real danger lies in the accumulation of static electricity, and the resulting electrostatic discharge.
Electrostatic discharge (ESD) damage to PCBA processing
In the process of production, packaging and transportation, and the processing, debugging and testing of the integrated machine, it is inevitable to suffer from external or own friction and form a high surface potential.
What is PCBA blending degree
There are two important concepts in IPC-SM-782, "Producibility Levels" and "Component Mounting Complexity Levels", which are different but have corresponding three levels.
The expansion of manufacturability design concept
The concept of DFM was first proposed in 1995 by the American Federation of Fittings Association and introduced into China in the late 1990s. "Circuit manufacturability design" is a new design concept put forward in 1998.
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