Keyou circuit is a professional production of high precision double-sided multilayer circuit board, module gold circuit board, car circuit board, car charging circuit board, traffic recorder,COB power supply, computer motherboard, medical circuit board, m
Keyou Circuit is a professional production of high precision multilayer circuit board, module gold circuit board, car circuit board, car circuit board, traffic recorder,COB power supply, computer motherboard, medical circuit board, module board, thermoele
As the function requirement of electronic products is higher and higher, the volume requirement is smaller and smaller. In order to meet this need, the welding ball array packaging technology appears.
PCB board test system will have a new design idea, the use of automatic test system based on USB bus and virtual instrument design idea, give full play to the role of the computer
The platen method of this new concept is called "mass platen" or "large platen". In recent years, there have been many professional OEM pressing industry.
Halogen-free PCB printed circuit boards have low water absorption and meet the requirements of environmental protection, in other performance can also meet the quality requirements of PCB board.
Based on many years of actual production experience and service experience, the author now makes a brief analysis of the causes of bubbling on the copper plating surface of the circuit board.
In terms of the overall process capability of SMT today, the solder paste printing ability is the worst. Because the solder paste printing more or less or the printing offset are related to the quality of the solder behind, it is the most need to be speci
In PCBA processing, there are mainly three kinds of commonly used electronic components repair: Chip component repair, multi-pin device repair and BGA repair.
The so-called solder paste low viscosity phenomenon refers to the phenomenon that the parts have no way to be glued to the solder paste during or after the punching.
In the process of PCBA processing, there are often some problems of poor printing: tin, tin infiltration, tin paste collapse, tin paste powder, tin paste tapering, less tin, more tin, offset.
The content of PCB incoming material inspection includes PCB size and appearance inspection, PCB warping and distortion detection, PCB weldability test, PCB solder resistance film integrity test, PCB internal defect detection.
