The high floor board uses high TG, high speed, high frequency, thick copper, thin dielectric layer and other special materials, which puts forward high requirements for the inner line fabrication and graphic size control.
SMT production line has a lot of equipment, and different production lines need to place different equipment, mainly divided into semi-automatic SMT line and automatic SMT line.
By using SMT, the PCB does not need to be drilled into it. Instead, what they do is they use solder paste. In addition to adding a lot of speed, this simplifies the process significantly.
We should not only master various maintenance methods and analysis methods, but also learn and use them flexibly. To be calm, to work hard, to guard against arrogance and impetuous, to maintain a common heart, to make a difference.
PCB board depends on science and technology, naturally must not lag behind, so the layout of high frequency PCB has become the key point to discuss when we design PCB high frequency board.
SMT can greatly reduce production time. Moreover, SMT components can be placed in the thousands per hour, compared to less than a thousand for through-hole installations.
PC8 production is not difficult, the difficulty lies in the production of fault troubleshooting. Whether it is an individual hobbyist or an industry engineer, it is quite troublesome to encounter problems when debugging PCB circuit boards.
In the PCB design concept should be reduced as much as possible through the hole. If the number of parallel lines in the same direction is large and dense, they will be joined together during welding.
Ink in the production to protect the role of copper foil, so that the copper skin is not exposed to the outside, will affect the later process, sensitive ink, carbon oil, silver oil, and carbon oil and silver oil have electrical conductivity.
In fact, printed PCB circuit boards used in electronic equipment are different, and printed PCB circuit boards are classified differently according to different specifications.
The automotive PCB market is benefiting from the increasing electronization of vehicles as consumers demand more functionality and safety.
When selecting circuit board components based on component packaging, the following needs to be considered: component packaging selection. Grounding methods. Virtual component packaging. Verify complete material list data. Sort. Excess gate circuit.
