LED current size
WillSemi's Cadence custom integrated circuit design process not only cuts analog design and implementation time in half, but also reduces overall design cycle time by a third.
WillSemi's Cadence custom integrated circuit design process not only cuts analog design and implementation time in half, but also reduces overall design cycle time by a third.
Some do not notice this phenomenon, directly adjust the sense resistance or working frequency to reach the required current, which may seriously affect the service life of LED.
The PCB layout and wiring can be adjusted to prevent ESD Static electricity from the human body, the environment and even inside electronic equipment can cause various damage to the precision semiconductor chip.
With Spectre circuit simulation platform, WillSemi maintains design integrity throughout the design cycle, increasing simulation throughput and improving productivity.
The absence of domestic manufacturers in PDK has affected the development of domestic EDA industry to some extent. Relevant people told the semiconductor industry observer reporter.
It is made of materials, generally using epoxy glass cloth coated copper foil plate to make, its main performance requirements have very high communication electronics, the production process is very, the process generally includes plugging method, proces
high temperature conditions of welding, the iron head is often treated by electroplating. Some iron heads are also made of alloy materials that are not easy to oxidize. The new iron head should be tinned before formal welding.
Manual welding is a very practical skill, after understanding the general method, to practice more; More practice, can have better welding quality.
The use of strong alkali can make the dry film dissolution or peeling properties of the unwanted dry film from the surface peel or dissolve corrosion plate: the use of bivalence copper ammonium and ion oxidation to the unwanted copper from the plate corro
At the same time, the direction of the power cord and ground wire is consistent with the direction of data transmission, which helps to enhance the anti-noise capability.
The design of printed circuit board mainly refers to the layout design, which needs to consider the layout of external connections.
The characteristics of selective welding process are studied by comparing with wave soldering. The most obvious difference between the two is that the lower part of the printed circuit board in wave soldering is completely immersed in the liquid solder.