Specification for PCB storage and inspection in SMT factory
PCB inspection contents: ① appearance inspection: ② size measurement: ③ furnace temperature test: ④ pad welding force test: ⑤ Check the PCB board factory report
PCB inspection contents: ① appearance inspection: ② size measurement: ③ furnace temperature test: ④ pad welding force test: ⑤ Check the PCB board factory report
When the welding ends or pins of components are oxidized or contaminated, welding defects such as poor wetting, virtual welding and voids will occur in reflow welding. Poor coplanar properties of components will also lead to welding defects such as virtua
PCBA processing and SMT processing differenceThe whole process of PCBA processing actually includes SMT patch processing. SMT patch processing is only part of the PCBA process, which literally means a wider range of processes
The requirements of the mechanical motion part of the SMT machine are as follows: 1. Design, manufacture and assembly technology of micro, precision and high precision mechanical parts; 2, sports machinery express response, low loss, high efficiency, prec
Key points of solder paste printing technology: 1, the Angle of the printing press scraper and steel mesh, 2, scraper pressure, 3, scraper speed, 4, printing gap, 5, release speed
SMT production line has a lot of equipment, and different production lines need to place different equipment, mainly divided into semi-automatic SMT line and automatic SMT line.
PCB design must meet the requirements of SMT equipment, otherwise it will affect the production efficiency and quality, and may even be unable to complete automatic SMT by computer.
By using SMT, the PCB does not need to be drilled into it. Instead, what they do is they use solder paste. In addition to adding a lot of speed, this simplifies the process significantly.
What inspection should be done before SMT patch processing: first, SMT patch components inspection, second, printed circuit board (PCB) inspection, third, SMT patch processing precautions
SMD materials must be exquisite, not ready for SMT patch proofing. There are still some problems with SMD materials, from the quantity of incoming materials to the specific specifications and parameters of the materials, we must pay attention to, so that
SMT can greatly reduce production time. Moreover, SMT components can be placed in the thousands per hour, compared to less than a thousand for through-hole installations.
Failure analysis is an important part in the reliability of SMT electronic assembly process. It is necessary to have certain testing and analysis equipment to carry out the failure analysis of electronic process.