The following seven factors that will affect welding are summarized: first, welding heating bridge, second, pin welding force, third, choice of soldering iron head, fourth, temperature setting, fifth, use of flux, sixth, transfer welding operation, sevent
Static electricity is the relatively static charge, is the excess or insufficient static charge on the surface of the object; Is a physical phenomenon in which the positive and negative charges on the surface of an object are separated.The basic physical
Tin beads have serious harm to electronic products, so how to reduce tin beads is one of the key management and control contents of SMT enterprises.
The installation and welding of surface assembly parts are mainly divided into two basic technology methods, which are solder paste - reflow welding process - patch glue - wave soldering process
SMT patch factory control method of temperature and humidity sensitive elements: 1, environmental control, 2, process control, 3, control method
PCBA is one of the basic components of electronic components, PCB it through surface assembly technology (SMT), and the whole process of DIP plug-in insertion, known as PCBA process.
SMT patch processing solder paste need to pay attention to: 1, constant temperature: 2, delivery: 3, freezing :4, situation: 5, applied old solder paste :6, on the steel net paste amount:
The physical characteristics of flux refer to melting point, surface tension, viscosity, mixing and so on, which are related to welding performance.
Eliminate tin bead operation as far as possible not through direct removal of tin bead, in the production process to pay attention to: 1, steel mesh: 1, according to the size of the welding plate opening, 2, steel mesh but thick, 3, when mounting pressure
The main adverse phenomena in the solder paste printing process of SMT patch processing are as follows:After printing, the solder paste is not enough and gradually spreads to the outside of the pad. Reason analysis: 1, the scraper pressure is too large, 2
Analysis of the causes of short-circuit defects: 1, the solder paste collapse 2, the bottom surface of the steel mesh contaminated, 3, the pressure is too large to lead to the solder paste from the bottom of the steel mesh seepage surface overflow pad to
To introduce the most detailed process of SMT patch:1, PCB board, 2, three anti-paint coating