PCB wiring
Grounding should be added when necessary, two adjacent layers of wiring should be vertical to each other, parallel easy to produce parasitic coupling.
Grounding should be added when necessary, two adjacent layers of wiring should be vertical to each other, parallel easy to produce parasitic coupling.
Multilayer circuit board, usually through the hole plate, first board, second board, second stack plate these several. Higher level such as three - level board, arbitrary layer interconnection board usually used very little.
unused gate circuits are often used for design improvements later, and they may be converted into circuits. So it is also important that they are tested from the start to ensure that their artifacts are reliable.
There are many aspects of PCB design that need to take into account the safe spacing. It is classified into two categories: one is electrical related safety spacing and the other is non-electrical related safety spacing.
It is best not to use electrolytic capacitors, electrolytic capacitors are two layers of thin film rolled up, this rolled up structure at high frequency performance as inductance, the best use of bile capacitors or polycarbonate gestation capacitors.
In the actual design, the frequency, power rate and gain should be considered comprehensively to decide whether to add shielding plate.
The diode junction capacitance forms high-frequency attenuation oscillation, and the equivalent series inductance of the filter capacitor weakens the function of the filter.
The configuration of decoupling capacitance can suppress the noise caused by load changes, which is a common practice in the reliability design of printed circuit boards.
PCB ink quality is excellent, in principle can not be separated from the combination of the above major components. Ink quality is excellent, is the formula of science, advanced and environmental protection of the comprehensive embodiment.
This paper introduces various techniques of the three types of interconnect design, including device installation methods, wiring isolation and measures to reduce lead inductance.
In order to alleviate this design pressure, communication chip manufacturers have to choose to develop higher speed IC products to meet the needs of large capacity and small volume products.
The production process of high frequency and high speed PCB board is basically the same as that of ordinary PCB board.