Analysis of bypass capacitance in high speed PCB
Only each module has good EMC and low EMI can ensure the realization of the whole system function.
Only each module has good EMC and low EMI can ensure the realization of the whole system function.
Because the wider the printed line is, the smaller the inductance is, the lead line from the pad to the hole should be widened as far as possible, and the width of the pad should be the same as far as possible. In this way, even the capacitance of 0402 pa
PCB copy board process some small principles :1, printed wire width selection basis: 2, line spacing: 3, pad: 4, draw circuit frame: 5, component layout principle: 6, input signal processing unit, 7, component placement direction: 8, component spacing. 9.
The key factors of PCBA crimping technology are as follows: (1) crimping end; ② Printed board; ③ crimping process; (4) Crimping tools and equipment
In order to meet customer requirements, the circuit board must plug holes through the hole, after a lot of practice, change the traditional aluminum sheet plug process, with white mesh to complete the circuit board surface welding and plug holes.
General circuit board production will be carried out board work, its purpose is to increase the production efficiency of SMT production line.
According to the activity of flux, it can be divided into active (RA), medium active (RMA), inactive (R), water washing (OA), no cleaning (NC)
5 PCBA processing automation production of PCB size, shape, transmission edge, positioning hole, positioning symbol requirements.
In the process of electronic machining, the smaller the Angle of the scraper affects the vertical force of the solder paste, the greater the vertical component of the force.
Significance of PCB cleaning after surface mounting welding: 1. PCB cleaning after surface mounting welding can prevent the occurrence of electrical defects. 2. PCB cleaning after surface mounting and welding can eliminate corrosive substances. 3. The PCB
Different welding resistance film due to the composition, content is different, and coating bonding force is not consistent, so the adhesion degree of coating and printed board welding resistance film and coating molecular polarity is closely related to t
To provide you with effective skills to improve PCB design spread rate and design efficiency: 1, determine the number of PCB layers, 2, design rules and restrictions, 3, component layout, 4, fan out design, 5, manual wiring and key signal processing, 6, a