The basic PCB design process is as follows: preliminary preparation →PCB structure design → mesh guide → rule setting →PCB layout → Wiring → routing optimization and silk screen → network and DRC inspection and structure inspection → output light drawing
Board explosion caused by water absorption accounted for 70% of the defects, other reasons such as PCB structure uneven growth and contraction, cold and heat imbalance, process injury and bad blackening.
In PCB proofing, the copper foil part is pre-coated with a layer of lead tin anticorrosive layer, which remains in the outer layer of the board, that is, the graphic part of the circuit, and then the rest of the copper foil is chemically etched, known as
The silk screen position number does not determine whether the final patch is correct. Many experienced engineers found that deleting the bit number silk screen printing, PCBA product patch back and no problem. Generally, the machine patch locates the dev
Printed circuit board PCB copper wire off bad, PCB factories are said to be laminate problems, requiring its production factory to bear bad losses.
In PCBA manufacturing, automatic optical detection is set at the last step of the SMT production line. After the SMT patch processing is completed, product defect detection is required. Through timely detection and reduction of defects, improve assembly e
Circuit diagram, also known as circuit schematic diagram, is a kind of drawings reflecting the electrical connection of each component of electronic equipment. The circuit diagram consists of some abstract symbols, according to certain rules.
Modern PCBA electronic assembly is a complex process, in the process of production, due to PCB substrate, PCB board processing process factors lead to PCB defects.
The welding methods of PCBA: (1) split welding method: (2) centralized welding method: (3) residual welding method: (4) shear welding method
The design of PCB starts from determining the size of the board. The size of PCB is limited by the size of the case shell, so that it can be placed into the shell exactly. Secondly, the connection mode of PCB and external components should be considered.
Solutions to impedance discontinuity problems in PCB design: 1. Gradient line, 2. Corner, 3. Large pad, 4. Through hole, 5. Through hole coaxial connector
The closed physical border is a basic platform for future component layout and wiring, and also a constraint on automatic layout. Corner place best use arc, on the one hand can avoid sharp Angle scratch workers, but also can reduce the stress effect.