Common PCB board substrate analysis
The properties of the developed substrate materials are provided to the designer of the whole electronic products in time, so that the designer can establish accurate and advanced data basis.
The properties of the developed substrate materials are provided to the designer of the whole electronic products in time, so that the designer can establish accurate and advanced data basis.
Many peers have completed the planning of electronic products often appear problems. Related to the lack of necessary elements in the planning of electrical principles, but more important is when all necessary elements are considered.
Gold deposition is used by chemical deposition, through the method of chemical REDOX reaction to generate a layer of coating, generally thick, is a kind of chemical nickel gold deposit method, can reach a thicker gold layer.
The cooling metal block of the three-end voltage regulator must be well grounded. The grounding isolation belt near the crystal oscillator must be well grounded.
With the rapid development of mobile phone, electronics, communication industry, automatic driving, to a large extent, the PCB circuit board industry continues to grow and grow rapidly, people for the quality of PCB components, layers, weight, precision,
At the same time, physical and chemical changes are formed on the surface of the functional groups of the gas composition, so as to improve the bonding force of copper plating, pollution removal and other plate loading effects.
The measurement method is to dissolve the sample in hot alcohol with titanium phenol as an indicator, titration required potassium hydroxide milligram number, namely its acid value.
PCB surface needs to be welded components, so a part of the copper layer needs to be exposed for welding. These exposed layers of copper are called pads. The pad is generally rectangular or circular, and the area is small.
PCBA welding processing, usually PCB board has a lot of requirements, and must meet the requirements of the board to accept welding processing.
In a circuit with resistance, inductance, and capacitance, an obstacle to alternating current is called an impedance. Impedance is usually denoted by Z, which is a complex number.
In PCB proofing, how to reduce or eliminate the deformation caused by different material characteristics or processing has become one of the most complicated problems faced by PCB manufacturers.
PCB board parts in storage also has a certain impact on deformation, in some manufacturers due to more production, small site, will stack a number of boards together storage, which will also lead to external deformation of the board.