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8-layer 1-stage HDI rigid-flex board
Name: 8-layer 1-stage HDI rigid-flex board
Plate: NPG-170
Plate thICkness: 1.2 mm
Layers: 8 layers
Minimum line width/line spacing: 3/3 mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 2
Surface Technology: Immersion Gold
Dielectric constant: 4.2
Loss factor: 0.010
Use: Medical Equipment
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10-layer 2-stage HDI rigid-flex board
Name: 10-layer 2-stage HDI rigid-flex board
Plate: Taiguang EM-888S
Plate thICkness: 1.0 mm
Layers: 10 layers
Minimum line width/line spacing: 4/4mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 3
Surface Technology: Immersion Gold
Dielectric constant: 3.8
Loss factor: 0.0055
Use: security monitoring equipment
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8-layer 2-stage HDI rigid-flex board
Name: 8-layer 2-stage HDI rigid-flex board
Layers: 8L
Structure: 3F+5R (8-layer 2-level HDI)
Sheet Type: PI, PET, PEN
Minimum hole: 0.1mm
PI thICkness: 0.5mil-2mil
Cu Thickness: 1/3oz-2oz
Minimum line width/line spacing: 0.1/0.1mm;
NPTH Finished Aperture Tolerance: ±1mil(±0.025mm)
PTH Finished Aperture Tolerance: ±2mil(±0.050mm)
Finished plate thickness tolerance: ±0.01mm
Minimum line width/line gap: 0.05/0.05mm
Application field: High-end precision industrial sensor control board
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10-layer 2-stage HDI rigid-flex board
Name: 10-layer 2-stage HDI rigid-flex board
Plate: Taiguang EM-888S
Plate thICkness: 1.0 mm
Layers: 10 layers
Minimum line width/line spacing: 4/4mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 3
Surface Technology: Immersion Gold
Dielectric constant: 3.8
Loss factor: 0.0055
Use: security monitoring equipment
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Name: 8-layer rigid-flex PCB board
Layers: 8L
Plate thICkness: 1.45mm
Minimum aperture: 0.25mm
Minimum line width/line spacing: 5/3.6mil
Inner layer copper thickness: HOZ
Outer copper thickness: 1OZ
Surface treatment: chEMIcal gold ENIG
Minimum distance from hole to line: 0.25mm
Application field: consumer electronics
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Name: 8L rigid-flex board
Layers: 8L
Plate thICkness: 1.45mm
Minimum aperture: 0.25mm
Minimum line width/line spacing: 5/3.6mil
Inner layer copper thickness: HOZ
Outer copper thickness: 1OZ
Surface treatment: chEMIcal gold ENIG
Minimum distance from hole to line: 0.25mm
Application field: consumer electronics
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Three-layer black oil rigid-flex board
Name: Three-layer black oil soft and hard board
Layers: 3L
Structure: 1R+1R+1R
Hard board thickness: 0.6MM
Copper thickness: 1OZ
Minimum line width/line spacing: 4mil/4mil
Process difficulties: black solder mask yellow cover film, immersion gold surface treatment.
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Name: 12-layer rigid-flex board
Layers: 12L
Structure: 5R+2F+5R
Plate thICkness: 1.6mm
Outer copper thickness: 1 OZ
Inner copper thickness: 1 OZ
Minimum aperture: 0.25mm
Minimum line width/line spacing: 3.5mil
Surface Treatment: Immersion Gold
Product use: process controller
Technological difficulties: The flexible and rigid board is a 12-layer high multi-layer structure, DuPont AP9141R high-performance flexible board
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Name: 12-layer Rigid Flex PCBs
Layers: 12L
Structure: 4R+4F+4R
Plate thICkness: 1.8mm
Outer copper thickness: 1 OZ
Inner copper thickness: 1 OZ
Minimum aperture: 0.3mm
Minimum line width/line spacing: 4mil
Surface Treatment: Immersion Gold
Product use: intelligent robot
Process difficulty: high multi-layer rigid flex PCBs
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Name: Four-layer rigid-flex board
Structure: 1R+2F+1R
Layers: 4L
Plate thICkness: 0.55mm
Outer copper thickness 1 OZ
Inner layer copper thickness H OZ
Minimum aperture: 0.2mm
Minimum line width/line spacing: 3mil
Surface Treatment: Immersion Gold
Product use: Leica CAMera
Process difficulties: strict impedance matching requirements
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Name: TWS Earphone Rigid Flex PCBs
Layers: 6L
Structure: 2R+2F+2R (HDI structure)
Plate thICkness: 1.0mm
Outer copper thickness: 1 OZ
Inner copper thickness: 1 OZ
Minimum aperture: 0.2mm
Minimum line width/line spacing: 3mil
Surface Treatment: Immersion Gold
Product use: TWS bluetooth headset
Process difficulty: The Rigid Flex PCBs are 1st-order HDI structure rigid flex PCBs
- PCB manufacturing equipment
PCB Drilling machine
PCB pattern plating line
PCB solder mask expose machine
PCB pattern expose machine
Strip film etching line
Solder mask screen silk print machine
Solder mask scrubbing line
PCB Flying Probe Test (FPT)
Fully automatic exposure machine
The company has successively cooperated with more than 3,000 high-tech R&D, manufacturing and service companies around the world, with technical solutions covering medical, industrial control, artificial intelligence, Internet of Things, automotive electronics, smart home and other fields.
Rigid-flex printed circuit boards are mainly divided into three types, including single-sided rigid-flex PCB, double-sided rigid-flex PCB, and multi-layer rigid-flex PCB.
A rigid-flex PCB is a hybrid board that integrates components from a rigid board and a flex circuit. It offers several advantages, including improved reliability and reduced weight.