8-layer 1-stage HDI rigid-flex board
Name: 8-layer 1-stage HDI rigid-flex board
Plate: NPG-170
Plate thICkness: 1.2 mm
Layers: 8 layers
Minimum line width/line spacing: 3/3 mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 2
Surface Technology: Immersion Gold
Dielectric constant: 4.2
Loss factor: 0.010
Use: Medical Equipment
10-layer 2-stage HDI rigid-flex board
Name: 10-layer 2-stage HDI rigid-flex board
Plate: Taiguang EM-888S
Plate thICkness: 1.0 mm
Layers: 10 layers
Minimum line width/line spacing: 4/4mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 3
Surface Technology: Immersion Gold
Dielectric constant: 3.8
Loss factor: 0.0055
Use: security monitoring equipment
8-layer 2-stage HDI rigid-flex board
Name: 8-layer 2-stage HDI rigid-flex board
Layers: 8L
Structure: 3F+5R (8-layer 2-level HDI)
Sheet Type: PI, PET, PEN
Minimum hole: 0.1mm
PI thICkness: 0.5mil-2mil
Cu Thickness: 1/3oz-2oz
Minimum line width/line spacing: 0.1/0.1mm;
NPTH Finished Aperture Tolerance: ±1mil(±0.025mm)
PTH Finished Aperture Tolerance: ±2mil(±0.050mm)
Finished plate thickness tolerance: ±0.01mm
Minimum line width/line gap: 0.05/0.05mm
Application field: High-end precision industrial sensor control board
10-layer 2-stage HDI rigid-flex board
Name: 10-layer 2-stage HDI rigid-flex board
Plate: Taiguang EM-888S
Plate thICkness: 1.0 mm
Layers: 10 layers
Minimum line width/line spacing: 4/4mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 3
Surface Technology: Immersion Gold
Dielectric constant: 3.8
Loss factor: 0.0055
Use: security monitoring equipment
Name: 8-layer rigid-flex PCB board
Layers: 8L
Plate thICkness: 1.45mm
Minimum aperture: 0.25mm
Minimum line width/line spacing: 5/3.6mil
Inner layer copper thickness: HOZ
Outer copper thickness: 1OZ
Surface treatment: chEMIcal gold ENIG
Minimum distance from hole to line: 0.25mm
Application field: consumer electronics
Name: 8L rigid-flex board
Layers: 8L
Plate thICkness: 1.45mm
Minimum aperture: 0.25mm
Minimum line width/line spacing: 5/3.6mil
Inner layer copper thickness: HOZ
Outer copper thickness: 1OZ
Surface treatment: chEMIcal gold ENIG
Minimum distance from hole to line: 0.25mm
Application field: consumer electronics
Three-layer black oil rigid-flex board
Name: Three-layer black oil soft and hard board
Layers: 3L
Structure: 1R+1R+1R
Hard board thickness: 0.6MM
Copper thickness: 1OZ
Minimum line width/line spacing: 4mil/4mil
Process difficulties: black solder mask yellow cover film, immersion gold surface treatment.
Name: 12-layer rigid-flex board
Layers: 12L
Structure: 5R+2F+5R
Plate thICkness: 1.6mm
Outer copper thickness: 1 OZ
Inner copper thickness: 1 OZ
Minimum aperture: 0.25mm
Minimum line width/line spacing: 3.5mil
Surface Treatment: Immersion Gold
Product use: process controller
Technological difficulties: The flexible and rigid board is a 12-layer high multi-layer structure, DuPont AP9141R high-performance flexible board
Name: 12-layer Rigid Flex PCBs
Layers: 12L
Structure: 4R+4F+4R
Plate thICkness: 1.8mm
Outer copper thickness: 1 OZ
Inner copper thickness: 1 OZ
Minimum aperture: 0.3mm
Minimum line width/line spacing: 4mil
Surface Treatment: Immersion Gold
Product use: intelligent robot
Process difficulty: high multi-layer rigid flex PCBs
Name: Four-layer rigid-flex board
Structure: 1R+2F+1R
Layers: 4L
Plate thICkness: 0.55mm
Outer copper thickness 1 OZ
Inner layer copper thickness H OZ
Minimum aperture: 0.2mm
Minimum line width/line spacing: 3mil
Surface Treatment: Immersion Gold
Product use: Leica CAMera
Process difficulties: strict impedance matching requirements
Name: TWS Earphone Rigid Flex PCBs
Layers: 6L
Structure: 2R+2F+2R (HDI structure)
Plate thICkness: 1.0mm
Outer copper thickness: 1 OZ
Inner copper thickness: 1 OZ
Minimum aperture: 0.2mm
Minimum line width/line spacing: 3mil
Surface Treatment: Immersion Gold
Product use: TWS bluetooth headset
Process difficulty: The Rigid Flex PCBs are 1st-order HDI structure rigid flex PCBs
- PCB manufacturing equipment
The company has successively cooperated with more than 3,000 high-tech R&D, manufacturing and service companies around the world, with technical solutions covering medical, industrial control, artificial intelligence, Internet of Things, automotive electronics, smart home and other fields.
Rigid-flex printed circuit boards are mainly divided into three types, including single-sided rigid-flex PCB, double-sided rigid-flex PCB, and multi-layer rigid-flex PCB.
A rigid-flex PCB is a hybrid board that integrates components from a rigid board and a flex circuit. It offers several advantages, including improved reliability and reduced weight.